
1.0 Hardware
(Continued)
1.3 FUNCTIONAL DESCRIPTION
This section provides details of the functional characteris-
tics of the CompactSPEECH processor. It is divided into the
following sections:
Resetting
Clocking
Power-down Mode
Power and Grounding
Memory Interface
Codec Interface
1.3.1 Resetting
The RESET pin is used to reset the CompactSPEECH proc-
essor.
On application of power, RESET must be held low for at
least t
pwr
after V
CC
is stable. This ensures that all on-chip
voltages are completely stable before operation. Whenever
RESET is applied, it must also remain active for not less
than t
RST
. During this period, and for 100
m
s after, the TST
signal must be high. This can be done with a pull-up resistor
on the TST pin.
The value of MWRDY is undefined during the reset period,
and for 100
m
s after. The microcontroller should either wait
before polling the signal for the first time, or the signal
should be pulled high during this period.
Upon reset, the ENV0 signal is sampled to determine the
operating environment. During reset, the EMCS/ENV0 pin is
used for the ENV0 input signals. An internal pull-up resistor
sets ENV0 to 1.
After reset, the same pin is used for EMCS.
System Load on ENV0
For any load on the ENV0 pin, the voltage should not drop
below V
ENVh
.
If the load on the ENV0 pin causes the current to exceed
10
m
A, use an external pull-up resistor to keep the pin at 1.
Figure 1-3 shows a recommended circuit for generating a
reset signal when the power is turned on.
TL/EE/12584–5
FIGURE 1-3. Recommended Power-On Reset Circuit
1.3.2 Clocking
The CompactSPEECH provides an internal oscIllator that
interacts with an external clock source through the X1 and
X2/CLKIN pins. Either an external single-phase clock sig-
nal, or a crystal oscillator, may be used as the clock source.
External Single-Phase Clock Signal
If an external single-phase clock source is used, it should be
connected to the CLKIN signal as shown in Figure 1-4, and
should conform to the voltage-level requirements for CLKIN
stated in Section 1.4.2.
TL/EE/12584–6
FIGURE 1-4. External Clock Source
Crystal Oscillator
A crystal oscillator is connected to the on-chip oscillator
circuit via the X1 and X2 signals, as shown in Figure 1-5.
TL/EE/12584–7
FIGURE 1-5. Connections for an
External Crystal Oscillator
Keep stray capacitance and inductance, in the oscillator cir-
cuit, as low as possible. The crystal resonator, and the ex-
ternal components, should be as close to the X1 and
X2/CLKIN pins as possible, to keep the trace lengths in the
printed circuit to an absolute minimum.
You can use crystal resonators with maximum load capaci-
tance of 20 pF, although the oscillation frequency may differ
from the crystal’s specified value.
Table 1-2 lists the components in the crystal oscillator cir-
cuit.
TABLE 1-2. Crystal Oscillator Component List
Component
Parameters
Values
Tolerance
Resonator
Crystal
Resonance Frequency 40.96 MHz
N/A
Third Overtone
Parallel
Type
AT-Cut
Maximum Serial
Resistance
50
X
Maximum Shunt
Capacitance
7 pF
Maximum Load
Capacitance
12 pF
Resistor R1
10 M
X
5%
Capacitor C1
1000 pF
20%
Inductor L
3.9
m
H
10%
http://www.national.com
7