參數(shù)資料
型號: MT58L128L36D1
廠商: Micron Technology, Inc.
英文描述: 128K x 36,3.3V I/O Pipelined, DCD SyncBurst SRAM(4Mb,3.3V輸入/輸出,流水線式,雙循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
中文描述: 128K的x 36,3.3六/輸出流水線,雙氰胺SyncBurst的SRAM(4MB,在3.3V的輸入/輸出,流水線式,雙循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
文件頁數(shù): 6/24頁
文件大?。?/td> 425K
代理商: MT58L128L36D1
6
4Mb: 256K x 18, 128K x 32/36 3.3V I/O Pipelined, DCD SyncBurst SRAM
MT58L256L18D1_2.p65 – Rev 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1999, Micron Technology, Inc.
4Mb: 256K x 18, 128K x 32/36
3.3V I/O PIPELINED, DCD SYNCBURST SRAM
PRELIMINARY
TQFP PIN DESCRIPTIONS
x18
37
36
x32/x36
37
36
32-35, 44-50,
81, 82, 99,
100
93
94
95
96
SYMBOL
SA0
SA1
SA
TYPE
Input
DESCRIPTION
Synchronous Address Inputs: These inputs are registered and must
meet the setup and hold times around the rising edge of CLK.
32-35, 44-50,
80-82, 99,
100
93
94
BWa#
BWb#
BWc#
BWd#
Input
Synchronous Byte Write Enables: These active LOW inputs allow
individual bytes to be written and must meet the setup and hold
times around the rising edge of CLK. A byte write enable is LOW
for a WRITE cycle and HIGH for a READ cycle. For the x18 version,
BWa# controls DQa pins and DQPa; BWb# controls DQb pins and
DQPb. For the x32 and x36 versions, BWa# controls DQa pins and
DQPa; BWb# controls DQb pins and DQPb; BWc# controls DQc pins
and DQPc; BWd# controls DQd pins and DQPd. Parity is only
available on the x18 and x36 versions.
Byte Write Enable: This active LOW input permits BYTE WRITE
operations and must meet the setup and hold times around the
rising edge of CLK.
Global Write: This active LOW input allows a full 18-, 32- or 36-bit
WRITE to occur independent of the BWE# and BWx# lines and must
meet the setup and hold times around the rising edge of CLK.
Clock: This signal registers the address, data, chip enable, byte write
enables and burst control inputs on its rising edge. All synchronous
inputs must meet setup and hold times around the clock’s rising
edge.
Synchronous Chip Enable: This active LOW input is used to enable
the device and conditions the internal use of ADSP#. CE# is sampled
only when a new external address is loaded.
Synchronous Chip Enable: This active LOW input is used to enable
the device and is sampled only when a new external address is
loaded.
Snooze Enable: This active HIGH, asynchronous input causes the
device to enter a low-power standby mode in which all data in the
memory array is retained. When ZZ is active, all other inputs are
ignored.
Synchronous Chip Enable: This active HIGH input is used to enable
the device and is sampled only when a new external address is
loaded.
Output Enable: This
active LOW, asynchronous input enables the
data I/O output drivers.
Synchronous Address Advance: This active LOW input is used to
advance the internal burst counter, controlling burst access after
the external address is loaded. A HIGH on this pin effectively causes
wait states to be generated (no address advance). To ensure use of
correct address during a WRITE cycle, ADV# must be HIGH at the
rising edge of the first clock after an ADSP# cycle is initiated.
87
87
BWE#
Input
88
88
GW#
Input
89
89
CLK
Input
98
98
CE#
Input
92
92
CE2#
Input
64
64
ZZ
Input
97
97
CE2
Input
86
86
OE#
Input
83
83
ADV#
Input
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相關(guān)PDF資料
PDF描述
MT58L128L32P1 128K x 32,Pipelined, SCD SyncBurst SRAM(4Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
MT58L128L36P1 128K x 36,Pipelined, SCD SyncBurst SRAM(4Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
MT58L128V32P1 128K x 32, Pipelined, SCD SyncBurst SRAM(4Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
MT58L256L18P1 256K x 18,Pipelined, SCD SyncBurst SRAM(4Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
MT58L256V18P1 256K x 18,Pipelined, SCD SyncBurst SRAM(4Mb,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
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