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參數(shù)資料
| 型號： | MT58L128L36D1 |
| 廠商： | Micron Technology, Inc. |
| 英文描述： | 128K x 36，3.3V I/O Pipelined, DCD SyncBurst SRAM(4Mb，3.3V輸入/輸出，流水線式，雙循環(huán)取消選擇，同步脈沖靜態(tài)存儲器) |
| 中文描述： | 128K的x 36,3.3六/輸出流水線，雙氰胺SyncBurst的SRAM（4MB，在3.3V的輸入/輸出，流水線式，雙循環(huán)取消選擇，同步脈沖靜態(tài)存儲器） |
| 文件頁數(shù)： | 14/24頁 |
| 文件大?。?/td> | 425K |
| 代理商： | MT58L128L36D1 |
14
4Mb: 256K x 18, 128K x 32/36 3.3V I/O Pipelined, DCD SyncBurst SRAM
MT58L256L18D1_2.p65 – Rev 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1999, Micron Technology, Inc.
4Mb: 256K x 18, 128K x 32/36
3.3V I/O PIPELINED, DCD SYNCBURST SRAM
PRELIMINARY
ABSOLUTE MAXIMUM RATINGS*
Voltage on V
DD
Supply
Relative to V
SS
............................... -0.5V to +4.6V
Voltage on V
DD
Q Supply
Relative to V
SS
............................... -0.5V to +4.6V
V
IN
.............................................. -0.5V to V
DD
Q + 0.5V
Storage Temperature (plastic) ............ -55°C to +150°C
Junction Temperature**................................... +150°C
Short Circuit Output Current ...........................100mA
*Stresses greater than those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only, and functional
operation of the device at these or any other conditions
above those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect reliability.
**Maximum junction temperature depends upon pack-
age type, cycle time, loading, ambient temperature and
airflow. See Micron Technical Note TN-05-14 for more
information.
DC ELECTRICAL CHARACTERISTICS AND OPERATING CONDITIONS
(0°C
￡
T
A
￡
+70°C; V
DD
, V
DD
Q = +3.3V +0.3V/-0.165V unless otherwise noted)
DESCRIPTION
Input High (Logic 1) Voltage
Input Low (Logic 0) Voltage
Input Leakage Current
Output Leakage Current
CONDITIONS
SYMBOL
V
IH
V
IL
IL
I
IL
O
MIN
2.0
-0.3
-1.0
-1.0
MAX
V
DD
+ 0.3
0.8
1.0
1.0
UNITS
V
V
μA
μA
NOTES
1, 2
1, 2
3
0V
￡
V
IN
￡
V
DD
Output(s) disabled,
0V
￡
V
IN
￡
V
DD
I
OH
= -4.0mA
I
OL
= 8.0mA
Output High Voltage
Output Low Voltage
Supply Voltage
Isolated Output Buffer Supply
V
OH
V
OL
V
DD
V
DD
Q
2.4
–
3.135
3.135
–
V
V
V
V
1, 4
1, 4
1
1, 5
0.4
3.6
3.6
NOTE:
1. All voltages referenced to V
SS
(GND).
2. Overshoot:
V
IH
￡
+4.6V for t
￡
t
KC/2 for I
￡
20mA
Undershoot:
V
IL
3
-0.7V for t
￡
t
KC/2 for I
￡
20mA
Power-up:
V
IH
￡
+3.6V and V
DD
￡
3.135V for t
￡
200ms
3. MODE pin has an internal pull-up, and input leakage = ±10μA.
4. The load used for V
OH
, V
OL
testing is shown in Figure 2. AC load current is higher than the stated DC values. AC I/O
curves are available upon request.
5. V
DD
Q should never exceed V
DD
. V
DD
and V
DD
Q can be connected together.
6. This parameter is sampled.
7. Preliminary package data.
TQFP CAPACITANCE
DESCRIPTION
Control Input Capacitance
Input/Output Capacitance (DQ)
Address Capacitance
Clock Capacitance
CONDITIONS
T
A
= 25°C; f = 1 MHz;
V
DD
= 3.3V
SYMBOL
C
I
C
O
C
A
C
CK
TYP
3
4
3
3
MAX
4
5
3.5
3.5
UNITS
pF
pF
pF
pF
NOTES
6
6
6
6
FBGA CAPACITANCE
DESCRIPTION
Address/Control Input Capacitance
Output Capacitance (Q)
Clock Capacitance
CONDITIONS
SYMBOL
C
I
C
O
C
CK
TYP
2.5
4
2.5
MAX
3.5
5
3.5
UNITS
pF
pF
pF
NOTES
6, 7
6, 7
6, 7
T
A
= 25°C; f = 1 MHz
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