參數(shù)資料
型號: MPC755BRX300LX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 45/48頁
文件大小: 1265K
代理商: MPC755BRX300LX
6
MPC755 RISC Microprocessor Hardware Specifications
Electrical and Thermal Characteristics
1.4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC755.
1.4.1 DC Electrical Characteristics
Table 1 to Table 7 describe the MPC755 DC electrical characteristics. Table 1 provides the absolute
maximum ratings.
Figure 2 shows the allowable undershoot and overshoot voltage on the MPC755.
Table 1. Absolute Maximum Ratings1
Characteristic
Symbol
Maximum Value
Unit
Note
Core supply voltage
Vdd
–0.3 to 2.5
V
4
PLL supply voltage
AVdd
–0.3 to 2.5
V
4
L2 DLL supply voltage
L2AVdd
–0.3 to 2.5
V
4
Processor bus supply voltage
OVdd
–0.3 to 3.465
V
3
L2 bus supply voltage
L2OVdd
–0.3 to 3.465
V
3
Input voltage
Processor bus
Vin
–0.3 to OVdd + 0.3 V
V
2, 5
L2 Bus
Vin
–0.3 to L2OVdd + 0.3 V
V
2, 5
JTAG Signals
Vin
–0.3 to 3.6
V
Storage temperature range
Tstg
–55 to 150
°C
Notes:
1. Functional and tested operating conditions are given in Table 3. Absolute maximum ratings are stress ratings
only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect
device reliability or cause permanent damage to the device.
2. Caution: Vin must not exceed OVdd or L2OVdd by more than 0.3 V at any time including during power-on
reset.
3. Caution: L2OVdd/OVdd must not exceed Vdd/AVdd/L2AVdd by more than 1.6 V at any time including during
power-on reset.
4. Caution: Vdd/AVdd/L2AVdd must not exceed L2OVdd/OVdd by more than 0.4 V at any time including during
power-on reset.
5. Vin may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.
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