參數(shù)資料
型號: MPC755BRX300LX
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
文件頁數(shù): 31/48頁
文件大小: 1265K
代理商: MPC755BRX300LX
MPC755 RISC Microprocessor Hardware Specifications
37
System Design Information
Figure 23. Driver Impedance Measurement Circuit
Alternately, the following is another method to determine the output impedance of the MPC755. A voltage
source, Vforce, is connected to the output of the MPC755 as in Figure 24. Data is held low, the voltage source
is set to a value that is equal to (L2)OVdd/2 and the current sourced by Vforce is measured. The voltage drop
across the pulldown device, which is equal to (L2)OVdd/2, is divided by the measured current to determine
the output impedance of the pulldown device, RN. Similarly, the impedance of the pullup device is
determined by dividing the voltage drop of the pullup, (L2)OVdd/2, by the current sank by the pullup when
the data is high and Vforce is equal to (L2)OVdd/2. This method can be employed with either empirical data
from a test set up or with data from simulation models, such as IBIS.
RP and RN are designed to be close to each other in value. Then Z0 = (RP + RN)/2.
Figure 24 describes the alternate driver impedance measurement circuit.
Figure 24. Alternate Driver Impedance Measurement Circuit
Table 18 summarizes the signal impedance results. The driver impedance values were characterized at 0°,
65°, and 105°C. The impedance increases with junction temperature and is relatively unaffected by bus
voltage.
(L2)OVdd
OGND
RP
RN
Pad
Data
SW1
SW2
(L2)OVdd
BGA
Data
Pin
Vforce
OGND
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