參數資料
型號: MCC5E0RX266WB0B
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 266 MHz, RISC PROCESSOR, CBGA840
封裝: 31 X 31 MM, 3.55 MM HEIGHT, 1 MM PITCH, CERAMIC, FCBGA-840
文件頁數: 98/120頁
文件大?。?/td> 1711K
代理商: MCC5E0RX266WB0B
Power and Thermal Characteristics
79
MOTOROLA GENERAL BUSINESS INFORMATION
C5ENPB0-DS REV 05
Figure 11 Package with Heat Sink Mounted to the Printed Circuit Board
Heat generated on the active side of the chip is conducted through the silicon, then
through the heat sink attach material (or thermal interface material), and finally to the
heat sink where it is removed by convection.
Because the silicon thermal resistance is quite small, for a first-order analysis, the
temperature drop in the silicon may be neglected. Thus, the thermal interface material
and the heat sink conduction/convective thermal resistances are the dominant terms.
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
j = T a + T r + (θjc + θint + θsa) x P d
where:
T
j is the die-junction temperature
T
a is the inlet cabinet ambient temperature
T
r is the air temperature rise within the computer cabinet
External Resistance
Internal Resistance
External Resistance
Radiation
Heat Sink
Printed Circuit Board (PCB)
Radiation
Convection
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Convection
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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