參數(shù)資料
型號: MCC5E0RX266WB0B
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 266 MHz, RISC PROCESSOR, CBGA840
封裝: 31 X 31 MM, 3.55 MM HEIGHT, 1 MM PITCH, CERAMIC, FCBGA-840
文件頁數(shù): 10/120頁
文件大小: 1711K
代理商: MCC5E0RX266WB0B
Marking Codes
107
MOTOROLA GENERAL BUSINESS INFORMATION
C5ENPB0-DS REV 05
Marking Codes
Table 63 explains the marking on the C-5e NP.
Reflow
Typical Reflow Profile for the C-5e Switch Module comprises:
1 Follow the guidelines recommended by your solder paste supplier.
Flux requirements must be met for best solderability.
2 The temperature profile should be carefully characterized to ensure uniform
temperature across the board and package.
Solder ball voiding may be affected by ramp rates and dwell times below and above
liquids.
3 A nitrogen atmosphere is not required, but will make the process more robust. It can
make a difference for marginally solderable PC board pads.
4 Full convection forced air furnaces work best, but IR, Convection/IR, or vapor phase can
be used.
Table 63 C-5e Network Processor Marking Codes
MARKING (EXPLANATION OF CODES)
Top
Logo/Part#/Date Code
Bottom
N/A
Pin 1 Marking Chamfered Corner
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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