參數(shù)資料
型號: MC7447RX1000NBR2
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360
文件頁數(shù): 7/87頁
文件大?。?/td> 1586K
代理商: MC7447RX1000NBR2
MOTOROLA
MPC7457 RISC Microprocessor Hardware Specifications
15
Electrical and Thermal Characteristics
1.5.2
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC7457. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Section 1.5.2.1, “Clock AC Specifications,”
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (SYSCLK) frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold
by maximum processor core frequency; see Section 1.11, “Ordering Information.”
1.5.2.1
Clock AC Specifications
Table 8 provides the clock AC timing specifications as defined in Figure 6and represents the tested
operating frequencies of the devices. The maximum system bus frequency, fSYSCLK, given in Table 8 is
considered a practical maximum in a typical single-processor system. The actual maximum SYSCLK
frequency for any application of the MPC7457 will be a function of the AC timings of the MPC7457, the
AC timings for the system controller, bus loading, printed-circuit board topology, trace lengths, and so forth,
and may be less than the value given in Table 8.
Typical
5.0
W
1, 2
Notes:
1. These values apply for all valid processor bus and L3 bus ratios. The values do not include I/O supply power (OVDD
and GVDD) or PLL supply power (AVDD). OVDD and GVDD power is system dependent, but is typically <5% of VDD
power. Worst case power consumption for AVDD < 3 mW.
2. Typical power is an average value measured at the nominal recommended VDD (see Table 4) and 65°C while
running the Dhrystone 2.1 benchmark and achieving 2.3 Dhrystone MIPs/MHz.
3. Maximum power is the average measured at nominal VDD and maximum operating junction temperature (see
Table 4) while running an entirely cache-resident, contrived sequence of instructions which keep all the execution
units maximally busy.
4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep
mode. As a result, power consumption for this mode is not tested.
Table 8. Clock AC Timing Specifications
At recommended operating conditions. See Table 4.
Characteristic
Symbol
Maximum Processor Core Frequency
Unit
Notes
867 MHz
1000 MHz
1200 MHz
1267 MHz
MinMax
Min
Max
MinMax
Processor frequency
fcore
600
867
600
1000
600
1200
600
1267
MHz
1
VCO frequency
fVCO
1200
1733
1200
2000
1200
2400
1200
2534
MHz
1
SYSCLK frequency
fSYSCLK
33
16733167
33
16733167
MHz
1, 2
SYSCLK cycle time
tSYSCLK
6.0
30
6.0
30
6.0
30
6.0
30
ns
2
SYSCLK rise and fall time
tKR, tKF
—1.0
ns
3
Table 7. Power Consumption for MPC7457 (continued)
Processor (CPU) Frequency
Unit
Notes
867 MHz
1000 MHz
1200 MHz
1267 MHz
相關(guān)PDF資料
PDF描述
MC7447RX1267LB 32-BIT, 1267 MHz, RISC PROCESSOR, CBGA360
MC7447RX1200LB 32-BIT, 1200 MHz, RISC PROCESSOR, CBGA360
MC7457VG1200LC 32-BIT, 1200 MHz, RISC PROCESSOR, CBGA483
MC7447RX867LB 32-BIT, 867 MHz, RISC PROCESSOR, CBGA360
MC7448VS1267NC 32-BIT, 1267 MHz, RISC PROCESSOR, CBGA360
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MC7447RX600NB 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB
MC7447RX733NB 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述: 制造商:MOTOROLA 功能描述:
MC7447RX867NB 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB
MC7448HX1000LC 功能描述:IC MPU RISC 32BIT 360-FCCBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤
MC7448HX1000LD 功能描述:微處理器 - MPU APL8 RV2.2.1 1.15V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324