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參數(shù)資料
| 型號(hào)： | MC7447RX1000NBR2 |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360 |
| 封裝： | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360 |
| 文件頁數(shù)： | 55/87頁 |
| 文件大?。?/td> | 1586K |
| 代理商： | MC7447RX1000NBR2 |
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MOTOROLA
MPC7457 RISC Microprocessor Hardware Specifications
59
System Design Information
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
1.9.8.3
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = TI + Tr + (RθJC + Rθint + Rθsa) × Pd
where:
Tj is the die-junction temperature
TI is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
RθJC is the junction-to-case thermal resistance
Rθint is the adhesive or interface material thermal resistance
Rθsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation, the die-junction temperatures (Tj) should be maintained less than the value specified in
Table 4. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta)
may range from 30° to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to 10°C.
The thermal resistance of the thermal interface material (Rθint) is typically about 1.5°C/W. For example,
assuming a Ta of 30°C, a Tr of 5°C, a CBGA package RθJC = 0.1, and a typical power consumption (Pd) of
18.7 W, the following expression for Tj is obtained:
Die-junction temperature:
Tj = 30°C + 5°C + (0.1°C/W + 1.5°C/W + θsa) × 18.7 W
For this example, a Rθsavalue of 2.1°C/W or less is required to maintain the die junction temperature below
the maximum value of Table 4.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the system-level
design and its operating conditions. In addition to the component's power consumption, a number of factors
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| MC7447RX600NB | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PPC7457RX1000NB |
| MC7447RX733NB | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Motorola Inc 功能描述: 制造商:MOTOROLA 功能描述: |
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| MC7448HX1000LC | 功能描述:IC MPU RISC 32BIT 360-FCCBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC74xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| MC7448HX1000LD | 功能描述:微處理器 - MPU APL8 RV2.2.1 1.15V 105C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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