參數(shù)資料
型號(hào): MC7447RX1000NBR2
廠商: MOTOROLA INC
元件分類(lèi): 微控制器/微處理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, CBGA360
封裝: 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360
文件頁(yè)數(shù): 54/87頁(yè)
文件大小: 1586K
代理商: MC7447RX1000NBR2
58
MPC7457 RISC Microprocessor Hardware Specifications
MOTOROLA
System Design Information
The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare joint results
in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 25). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure and is recommended due to the high power dissipation of the MPC7457. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
Figure 29. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially available thermal interfaces and adhesive
materials provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
0
0.5
1
1.5
2
0
1020
304050
6070
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
S
p
ec
if
ic
T
h
er
ma
lR
e
s
is
tan
ce
(
K
-i
n
.2
/W)
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