參數(shù)資料
型號(hào)： L64734
廠商： LSI CORP
元件分類： 消費(fèi)家電
英文描述： Tuner and Satellite Receiver Chipset
中文描述： SPECIALTY CONSUMER CIRCUIT, PQFP100
封裝： PLASTIC, QFP-100
文件頁(yè)數(shù)： 42/48頁(yè)
文件大?。?/td> 478K
代理商： L64734
42
L64733/L64734 Tuner and Satellite Receiver Chipset
Mechanical Drawing
Figure 15
is a mechanical drawing for the 48-pin TQFP L64733 package.
Figure 15
L64733 48-Pin TQFP Mechanical Drawing
TOP VIEW
D
D/2
E
E/2
A
e
SEE DETAIL “A”
BOTTOM VIEW
D1
D1/2
E1/2
E1
.15 MIN.
.50 MAX.
EXPOSED PAD
CORNER TAB DETAIL
EVEN LEAD SIDES
e/2
DETAIL “A”
DETAIL “B”
DATUM
PLANE
-H-
GAUGE PLANE
0.08/0.20 R.
0.25
0–7
°
L
A2
A1
0.08 R. MIN.
0.20 MIN.
1.00 REF.
b
WITH LEAD FINISH
0.09/0.16
BASE METAL
b1
0.09/0.20
8 PLACES
11–13
°
A
M
SEE DETAIL “B”
0
°
MIN.
0.95
1.00
1.05
S
Y
M
B
O
L
A
A1
A2
D
D1
E
E1
L
M
N
e
b
b1
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
AE
NOM.
MIN.
MAX.
1.20
0.15
0.05
0.10
9.00 BSC.
7.00 BSC.
9.00 BSC.
7.00 BSC.
0.60
0.45
0.14
0.75
48
0.5 BSC.
0.22
0.20
0.17
0.17
0.27
0.23
Notes:
1.
2.
All dimensioning and tolerancing conform to Ansi Y14.5–1982.
Datum
plane – H – i
s located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
Dimensions D1 and E1 do not include mold protrusion. allowable mold
protrusion is 0.254 mm on D1 and E1 dimensions.
The top of package is smaller than the bottom of package by
0.15 millimeters.
Dimension B does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08 mm total in excess of the B dimension at
maximum material condition.
Controlling dimension: millimeter.
Maximum allowable die thickness to be assembled in this package
family is 0.30 millimeters.
This outline conforms to Jedec Publication 95 Registration MO–136,
variations AC and AE.
Exposed die pad shall be coplanar with bottom of package within
2 mils (0.05 mm).
10. Metal area of exposed die pad shall be within 0.3 mm of the nominal
die pad size.
3.
4.
5.
6.
7.
8.
9.
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