參數(shù)資料
型號(hào): Intel386 EX
廠商: Intel Corp.
英文描述: Highly Integrated, 32-Bit, Fully Static Embedded Micropocessor(32位高集成完全靜態(tài)嵌入式微處理器)
中文描述: 高度集成,32位,全靜態(tài)嵌入式Micropocessor(32位高集成完全靜態(tài)嵌入式微處理器)
文件頁(yè)數(shù): 18/48頁(yè)
文件大?。?/td> 515K
代理商: INTEL386 EX
Special Environment
Intel386 EX Embedded Processor
14
PRELIMINARY
5.2
Component and Revision
Identifiers
To assist users, the processor holds a component
identifier and revision identifier in its DX register after
reset.
The upper 8 bits of DX hold the component
identifier. (The lower nibble, 3H, identifies the
Intel386 architecture, while the upper nibble, 2H,
identifies the second member of the Intel386
microprocessor family.)
The lower 8 bits of DX hold the revision level
identifier.
Table 4. Component and Revision Identifier
Register
Generally, the revision identifier chronologically
tracks those component steppings that have
improvements or distinction from previous steppings.
The revision identifier tracks that of the Intel386 CPU
whenever possible; steppings that change only
peripherals are not assigned new stepping numbers.
The revision identifier value is not guaranteed to
change with every stepping revision or to follow a
uniform numerical sequence. Intel has sole
discretion
over
these
component. The initial revision identifier for the
Intel386 EX microprocessor is 09H.
characteristics
of
the
5.3
Package Thermal Specifications
The Special Environment Intel386 EX embedded
processor is specified for operation with case
temperature (T
) within the range of -55°C to
+125°C. The case temperature can be measured in
any environment to determine whether the processor
is within the specified operating range. The case
temperature should be measured at the center of the
top surface opposite the pins.
An increase in the ambient temperature (T
) causes
a proportional increase in the case temperature
(T
) and the junction temperature (T
). A
packaged device produces thermal resistance
between junction and case temperatures (
θ
) and
between junction and ambient temperatures (
θ
).
The relationships between the temperature and
thermal resistance parameters are expressed by
these equations (P = power dissipated as heat = V
CC
×
I
CC
):
1.
T
J
= T
CASE
+ P
×
θ
JC
2.
T
A
= T
J
– P
×
θ
JA
3.
T
CASE
= T
A
+ P
×
[
θ
JA
θ
JC
]
A safe operating temperature can be calculated from
equation 1 by using the maximum safe T
of 125°C,
the maximum power drawn by the chip in the specific
design, and the
θ
value from Tables 5 or 6. The
θ
A
value depends on the airflow (measured at the top of
the chip) provided by the system ventilation. The
θ
A
values are given for reference only and are not
guaranteed.
DX Register
15
8
7
0
Component Identifier
Revision Level
Identifier
2H
3H
09H
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