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參數(shù)資料
| 型號(hào)： | ICS813076CYILFT |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數(shù)： | 7/23頁 |
| 文件大小： | 0K |
| 描述： | IC VCXO-PLL WIRELESS 64-TQFP |
| 標(biāo)準(zhǔn)包裝： | 500 |
| 系列： | HiPerClockS™, FemtoClock™ |
| 類型： | 時(shí)鐘/頻率發(fā)生器，扇出緩沖器（分配），抖動(dòng)衰減器，多路復(fù)用器 |
| PLL： | 是 |
| 主要目的： | 無線基礎(chǔ)架構(gòu)應(yīng)用 |
| 輸入： | HCSL，LVDS，LVHSTL，LVPECL，SSTL，晶體 |
| 輸出： | LVPECL |
| 電路數(shù)： | 1 |
| 比率 - 輸入:輸出： | 3:9 |
| 差分 - 輸入:輸出： | 是/是 |
| 頻率 - 最大： | 614.4MHz |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 64-TQFP 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 64-TQFP-EP（10x10） |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | 813076CYILFT |
IDT / ICS FREQUENCY GENERATOR/JITTER ATTENUATION
15
ICS813076CYI REV. A JULY 8, 2008
ICS813076I
FREQUENCY GENERATOR/JITTER ATTENUATION FOR WIRELESS INFRASTRUCTURE
FIGURE 7. ASSEMBLY FOR EXPOSED PAD THERMAL RELEASE PATH –SIDE VIEW (DRAWING NOT TO SCALE)
EPAD THERMAL RELEASE PATH
In order to maximize both the removal of heat from the package
and the electrical performance, a land patter n must be
incorporated on the Printed Circuit Board (PCB) within the footprint
of the package corresponding to the exposed metal pad or
exposed heat slug on the package, as shown in
Figure 7. The
solderable area on the PCB, as defined by the solder mask, should
be at least the same size/shape as the exposed pad/slug area on
the package to maximize the thermal/electrical performance.
Sufficient clearance should be designed on the PCB between the
outer edges of the land pattern and the inner edges of pad pattern
for the leads to avoid any shorts.
While the land pattern on the PCB provides a means of heat
transfer and electrical grounding from the package to the board
through a solder joint, thermal vias are necessary to effectively
conduct from the surface of the PCB to the ground plane(s). The
land pattern must be connected to ground through these vias.
The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”)
are application specific and dependent upon the package power
dissipation as well as electrical conductivity requirements. Thus,
thermal and electrical analysis and/or testing are recommended
to determine the minimum number needed. Maximum thermal
and electrical performance is achieved when an array of vias is
incorporated in the land pattern. It is recommended to use as
many vias connected to ground as possible. It is also
recommended that the via diameter should be 12 to 13mils (0.30
to 0.33mm) with 1oz copper via barrel plating. This is desirable to
avoid any solder wicking inside the via during the soldering process
which may result in voids in solder between the exposed pad/
slug and the thermal land. Precautions should be taken to
eliminate any solder voids between the exposed heat slug and
the land pattern. Note: These recommendations are to be used
as a guideline only. For further information, refer to the Application
Note on the Surface Mount Assembly of Amkor’s Thermally/
Electrically Enhance Leadfame Base Package, Amkor Technology.
GROUND PLANE
LAND PATTERN
SOLDER
THERMAL VIA
EXPOSED HEAT SLUG
(GROUND PAD)
PIN
PIN PAD
SOLDER
PIN
PIN PAD
SOLDER
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參數(shù)描述 |
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| ICS813078BYILF | 功能描述:IC VCXO PLL WIRELESS 64TQFP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 專用 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:1,500 系列:- 類型:時(shí)鐘緩沖器/驅(qū)動(dòng)器 PLL:是 主要目的:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 電源電壓:3.3V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:帶卷 (TR) 其它名稱:93786AFT |
| ICS813078BYILFT | 功能描述:IC VCXO PLL WIRELESS 64TQFP RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 專用 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:1,500 系列:- 類型:時(shí)鐘緩沖器/驅(qū)動(dòng)器 PLL:是 主要目的:- 輸入:- 輸出:- 電路數(shù):- 比率 - 輸入:輸出:- 差分 - 輸入:輸出:- 頻率 - 最大:- 電源電壓:3.3V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SSOP（0.209"，5.30mm 寬） 供應(yīng)商設(shè)備封裝:28-SSOP 包裝:帶卷 (TR) 其它名稱:93786AFT |
| ICS813078I | 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:FEMTOCLOCKS? VCXO-PLL FREQUENCY GENERATOR FOR WIRELESS INFRASTRUCTURE EQUIPMENT |
| ICS813252CKI-02LF | 功能描述:IC MULTIPLIER VCXO PLL 32-VFQFPN RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
| ICS813252CKI-02LFT | 功能描述:IC MULTIPLIER VCXO PLL 32-VFQFPN RoHS:是 類別:集成電路 (IC) >> 時(shí)鐘/計(jì)時(shí) - 時(shí)鐘發(fā)生器，PLL，頻率合成器 系列:HiPerClockS™, FemtoClock™ 標(biāo)準(zhǔn)包裝:27 系列:Precision Edge® 類型:頻率合成器 PLL:是 輸入:PECL，晶體 輸出:PECL 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/是 頻率 - 最大:800MHz 除法器/乘法器:是/無 電源電壓:3.135 V ~ 5.25 V 工作溫度:0°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC 包裝:管件 |
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