參數(shù)資料
型號(hào): HYB25D256160CC-5
廠商: INFINEON TECHNOLOGIES AG
英文描述: 256 Mbit Double Data Rate SDRAM
中文描述: 256兆雙倍數(shù)據(jù)速率SDRAM
文件頁(yè)數(shù): 91/94頁(yè)
文件大?。?/td> 3326K
代理商: HYB25D256160CC-5
HYB25D256[16/40/80]0C[E/C/F/T](L)
256 Mbit Double-Data-Rate SDRAM
System Characteristics for DDR SDRAMs
Data Sheet
91
Rev. 1.6, 2004-12
08012003-8754-PAQX
Figure 52
Pullup slew rate test load
Figure 53
Pulldown slew rate test load
Table 29
Output Slew Rate Characteristrics (
×4, ×8 Devices only)
Slew Rate Characteristic
Typical Range (V/ns) Minimum (V/ns)
Maximum (V/ns) Notes
Pullup Slew Rate
1.2 – 2.5
1.0
4.5
Pulldown Slew Rate
1.2 – 2.5
1.0
4.5
Table 30
Output Slew Rate Characteristics (
×16 Devices only)
Slew Rate Characteristic
Typical Range (V/ns)
Minimum (V/ns)
Maximum(V/ns)
Notes
Pullup Slew Rate
1.2 – 2.5
0.7
5.0
1)2)3)4)5)6)
1) Pullup slew rate is characterizted under the test conditions as shown in Figure 52
2) Pullup slew rate is measured between (
V
DDQ/2 – 320 mV ± 250 mV)
Pulldown slew rate is measured between (
V
DDQ/2 + 320 mV ± 250mV)
Pullup and Pulldown slew rate conditions are to be met for any pattern of data, including all outputs switching and only one
output switching.Example: For typical slew rate, DQ0 is switching.For minimum slew rate, all DQ bits are switchiung worst
case pattern. For maximum slew rate, only one DQ is switching from either high to low, or low to high the remainig DQ bits
remain the same as previous state.
3) Evaluation conditions: Typical: 25 °C (T Ambient),
V
DDQ = nominal, typical process.Minimum: 70 °C (T Ambient), VDDQ =
minimum, slow – slow process. Maximum: 0 °C (T Ambient),
V
DDQ = maximum, fast – fast process
4) Verified under typical conditions for qualification purposes.
5) TSOP II package devices only.
6) Only intended for operation up to 266 Mbps per pin.
Pulldown Slew Rate
1.2 – 2.5
0.7
5.0
7) Pulldown slew rate is measured under the test conditions shown in Figure 53.
Table 31
Output Slew Rate Matching Ratio Characteristics
Slew Rate Characteristic
DDR266A
DDR266B
DDR200
Notes
Parameter
Min. Max. Min. Max. Min.
Max.
Output SLew Rate Matching Ratio (Pullup to Pulldown) —
0.71
1.4
1) 2)
1) The ratio of pullup slew rate to pulldown slew rate is specified for the same temperature and voltage, over the entire
temperature and voltage range. For a given output, it represents the maximum difference between pullup and pulldown
drivers due to process variation.
2) DQS, DM, and DQ input slew rate is specified to prevent double clocking of data and preserve setup and hold times.
Signal transitions through the DC region must be monotonic
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