參數資料
型號: HD64F2319
英文描述: F-ZTAT Microcomputer On-Board Programming Application Note
中文描述: 架F - ZTAT微機板上編程應用指南
文件頁數: 9/67頁
文件大小: 382K
代理商: HD64F2319
Rev. 2.0, 03/06/02, 8
1.6
Closing a Workspace
Selecting [File-> Close Workspace] can close a HEW workspace. If there are any outstanding changes to the
workspace or any of its projects you will be requested whether or not you wish to save them.
Selecting [File-> Save Workspace] can save a HEW workspace.
1.7
Using Old Workspaces
The HEW can open any workspace that was created on a previous version of the HEW. This should not cause
any problems and any differences in the workspace file details should be upgraded on the open.
Note:
The upgraded project cannot be used in the previous environment. A back-up version of the initial
workspace or project file should have been saved if the project is used in the previous environment.
1.8
Exiting the HEW
The HEW can be exited by selecting [File->Exit], pressing ALT+F4 or by selecting the close option from the
system menu. (To open the system menu, click the icon at the upper-left corner of the HEW title bar.) If a
workspace is open then the same workspace closedown procedure is followed as described in the previous
section.
相關PDF資料
PDF描述
HD64F2326 H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD64F2328 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2329 H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD64F2329B Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2329E Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool
相關代理商/技術參數
參數描述
HD64F2319EVF25 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 標準包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C,LIN,SCI,SPI 外圍設備:LCD,LVD,POR,PWM,WDT 輸入/輸出數:53 程序存儲器容量:32KB(32K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數據轉換器:A/D 12x12b 振蕩器型:內部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤
HD64F2319EVTE25 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 標準包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設備:電容感應,DMA,LCD,POR,PWM,WDT 輸入/輸出數:25 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數據轉換器:A/D 2x20b,D/A 4x8b 振蕩器型:內部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2319EVTE25V 制造商:Renesas Electronics Corporation 功能描述:
HD64F2319VTE25 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2300 標準包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設備:電容感應,DMA,LCD,POR,PWM,WDT 輸入/輸出數:25 程序存儲器容量:64KB(64K x 8) 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數據轉換器:A/D 2x20b,D/A 4x8b 振蕩器型:內部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2319VTE25I 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 512KB Flash 3.3V 100-Pin TQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 512KB FLASH 3.3V 100TQFP - Trays