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| 型號： | HD64F2319 |
| 英文描述： | F-ZTAT Microcomputer On-Board Programming Application Note |
| 中文描述： | 架F - ZTAT微機(jī)板上編程應(yīng)用指南 |
| 文件頁數(shù)： | 51/67頁 |
| 文件大小： | 382K |
| 代理商： | HD64F2319 |
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Rev. 2.0, 03/06/02, 46
3.4
Setting Custom Build Phase Options
Once you have defined a custom phase, you will want to specify the command line options that should be used
when it is executed. Each defined phase has a menu option on the [Options] menu. To specify options for that
phase select it. The dialog that will be invoked depends upon whether the custom phase selected was a multiple
or single phase (according to the selection of phase type in figure 3.3b).
Figure 3.10: Custom Options Dialog
The dialog in figure 3.10 is a custom phase options dialog. The implementation of which is slightly different
depending on whether you are using a multiple or single shot phase. On the left-hand side is the project and file
list. It is possible to select multiple projects and files in the same way as Windows explorer to modify the
options for more than one selection. On the right-hand side are the 3 options tabs. This is where you set the
options that you want to apply to the selected file(s). You can also choose which configuration information is
being viewed from the configuration list on the upper left of the dialog box. Each configuration is listed along
with a special entry named “Multiple configurations…”. If you select multiple configurations then a dialog is
displayed which allows you to select more than one configuration. This method is used throughout HEW for
modifying multiple configurations at once.
3.4.1
Options Tab
The “Options” tab (figure 3.11) allows you to define the command line options that will be passed to the phase.
The “Command” field displays the command, which was entered when you defined the phase (figure 3.3d).
Enter into the “Options” field the command line arguments that you would like to pass to the command. If you
want to insert a placeholder, select the relevant placeholder from the “Placeholder” drop-down list box and then
click the “Insert” button. For a detailed description of placeholders see appendix C, “Placeholders” in the
Hitachi Embedded Workshop 2.1 User’s Manual.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2326 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2328 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2329B | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329E | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2319EVF25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設(shè)備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| HD64F2319EVTE25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2319EVTE25V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2319VTE25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2319VTE25I | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 512KB Flash 3.3V 100-Pin TQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 512KB FLASH 3.3V 100TQFP - Trays |
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