- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄353334 > HD64F2319 F-ZTAT Microcomputer On-Board Programming Application Note PDF資料下載
參數(shù)資料
| 型號(hào)： | HD64F2319 |
| 英文描述： | F-ZTAT Microcomputer On-Board Programming Application Note |
| 中文描述： | 架F - ZTAT微機(jī)板上編程應(yīng)用指南 |
| 文件頁數(shù)： | 8/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2319 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁當(dāng)前第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁
Rev. 2.0, 03/06/02, 7
1.4
Opening a Workspace
To open a workspace:
1. Select “Browse to another project workspace” option from the “Welcome!” dialog (figure 1.6) and press
“OK” or select [File->Open Workspace…]. The “Open Project Workspace” dialog will be invoked.
2. Select the workspace file that you want to open (.HWS files only).
3. Click “Open” to open the workspace.
If the HEW is set-up to display information when a workspace is opened then a workspace properties
dialog will be invoked (figure 1.8). Otherwise, the workspace will be opened.
Note that whether the workspace properties dialog is shown depends on the setting of either the “Show
workspace information on workspace open” check box on the workspace properties dialog or the
“Display workspace information dialog on opening workspace” check box on the “Workspace” tab of the
“Tools Options” dialog. This dialog is described in the “Specifying Workspace Options” section in
chapter 5, “Customizing the Environment”, in the Hitachi Embedded Workshop 2.1 User’s Manual. Click
“OK” to open the workspace. Click “Cancel” to stop opening the workspace.
Figure 1.8: Workspace Properties Dialog
The Hitachi Embedded Workshop keeps track of the last five workspaces that you have opened and adds them to
the file menu under the “Recent Workspaces” sub-menu. This gives you a shortcut to opening workspaces,
which you have used recently.
To open a recently used workspace:
1. Select “Open a recent project workspace” from the “Welcome!” dialog, select the name of the workspace
from the drop down list and then click “OK”.
or:
2. Select the [File->Recent Workspaces] menu option and from this sub-menu select the name of the
workspace.
Note:
The Hitachi Embedded Workshop only permits one workspace to be open at a time. Consequently, if
you attempt to open a second workspace, the first will be closed before the new one is opened.
1.5
Saving a Workspace
Selecting [File-> Save Workspace] can save a HEW workspace.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2326 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2328 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2329B | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329E | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2319EVF25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設(shè)備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲(chǔ)器容量:32KB（32K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| HD64F2319EVTE25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2319EVTE25V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2319VTE25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2319VTE25I | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 512KB Flash 3.3V 100-Pin TQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 512KB FLASH 3.3V 100TQFP - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。