- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄353334 > HD64F2319 F-ZTAT Microcomputer On-Board Programming Application Note PDF資料下載
參數(shù)資料
| 型號： | HD64F2319 |
| 英文描述： | F-ZTAT Microcomputer On-Board Programming Application Note |
| 中文描述： | 架F - ZTAT微機(jī)板上編程應(yīng)用指南 |
| 文件頁數(shù)： | 30/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2319 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁當(dāng)前第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁
Rev. 2.0, 03/06/02, 27
2.6.3
Stopping a Build
The Hitachi Embedded Workshop allows you to halt the build process.
To stop a build:
1. Select [Build->Stop Build] or click the stop build toolbar button (
). The build will be stop after the
current file has been built.
2. Wait until the message “Build Finished” appears in the “Output” window before continuing.
To forcibly terminate a current tool
1. Select [Build->Terminate Current Tool]. The HEW will attempt to stop the tool immediately.
Note:
Do NOT assume that any output from the tool you terminated is valid. It is recommended that you delete
any output files produced and ensure that the phase is executed again.
2.6.4
Building Multiple Projects
The Hitachi Embedded Workshop lets you build multiple projects and configurations at once.
To build multiple projects:
1.
Select [Build->Build Multiple]. The figure displayed in figure 2.18.
2.
The build multiple gives you the choice of which projects and configurations should be built. To select
which projects and configurations need to be built select the check box next to the project –
configuration combination you want to build. For example, in figure 2.18 if you wanted to build the
entire “hewtest2” project you would check the “hewtest2-Debug” and the “hewtest2-Release” selections
and leave all other check boxes unchecked.
3.
When you are happy with your chosen selection click the build button and the HEW will then build the
projects and configurations you have chosen.
4.
If you want to build all the projects which you choose, you click the build all button.
5.
Results from the build are displayed in the build window in the same way as the normal build process.
Figure 2.18: Build Multiple Dialog
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2326 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2328 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2329B | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2329E | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Debugger Users Manual/Cross tool |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2319EVF25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:160 系列:S08 核心處理器:S08 芯體尺寸:8-位 速度:40MHz 連通性:I²C，LIN，SCI，SPI 外圍設(shè)備:LCD，LVD，POR，PWM，WDT 輸入/輸出數(shù):53 程序存儲器容量:32KB（32K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1.9K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 12x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:64-LQFP 包裝:托盤 |
| HD64F2319EVTE25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2319EVTE25V | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2319VTE25 | 功能描述:IC H8S MCU FLASH 512K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2300 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2319VTE25I | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 512KB Flash 3.3V 100-Pin TQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 512KB FLASH 3.3V 100TQFP - Trays |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。