參數(shù)資料
型號(hào)： EP3SL340F1760C3N
廠(chǎng)商： Altera
文件頁(yè)數(shù)： 4/16頁(yè)
文件大?。?/td> 0K
描述： IC STRATIX III L 340K 1760-FBGA
產(chǎn)品培訓(xùn)模塊： Three Reasons to Use FPGA's in Industrial Designs
標(biāo)準(zhǔn)包裝： 3
系列： Stratix® III
LAB/CLB數(shù)： 13500
邏輯元件/單元數(shù)： 337500
RAM 位總計(jì)： 18822144
輸入/輸出數(shù)： 1120
電源電壓： 0.86 V ~ 1.15 V
安裝類(lèi)型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 1760-BBGA，F(xiàn)CBGA
供應(yīng)商設(shè)備封裝： 1760-FCBGA
1–12
Chapter 1: Stratix III Device Family Overview
Architecture Features
The design security feature is available when configuring Stratix III FPGAs using the
fast passive parallel (FPP) configuration mode with an external host (such as a MAX II
device or microprocessor), or when using fast active serial (AS) or passive serial (PS)
configuration schemes.
f For more information about the design security feature, refer to the Design Security in
SEU Mitigation
Stratix III devices have built-in error detection circuitry to detect data corruption due
to soft errors in the configuration random-access memory (CRAM) cells. This feature
allows all CRAM contents to be read and verified continuously during user mode
operation to match a configuration-computed CRC value. The enhanced CRC circuit
and frame-based configuration architecture allows detection and location of multiple,
single, and adjacent bit errors which, in conjunction with a soft circuit supplied as a
reference design, allows don’t-care soft errors in the CRAM to be ignored during
device operation. This provides a steep decrease in the effective soft error rate,
increasing system reliability.
On-chip memory block SEU mitigation is also offered using the ninth bit and a
configurable megafunction in the Quartus II software for MLAB and M9K blocks
while the M144K memory blocks have built-in error correction code (ECC) circuitry.
f For more information about the dedicated error detection circuitry, refer to the SEU
Programmable Power
Stratix III delivers Programmable Power, the only FPGA with user programmable
power options balancing today’s power and performance requirements. Stratix III
devices utilize the most advanced power-saving techniques, including a variety of
process, circuit, and architecture optimizations and innovations. In addition, user
controllable power reduction techniques provide an optimal balance of performance
and power reduction specific for each design configured into the Stratix III FPGA. The
Quartus II software (starting from version 6.1) automatically optimizes designs to
meet the performance goals while simultaneously leveraging the programmable
power-saving options available in the Stratix III FPGA without the need for any
changes to the design flow.
f For more information about Programmable Power in Stratix III devices, refer to the
following documents:
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP3SL340F1760C3NES 制造商:Altera Corporation 功能描述:IC FPGA 1120 I/O 1760FBGA 制造商:Altera Corporation 功能描述:IC STRATIX III L FPGA 1760FBGA
EP3SL340F1760C4 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP3SL340F1760C4L 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP3SL340F1760C4LN 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP3SL340F1760C4N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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