參數(shù)資料
| 型號： | EP3SL340F1760C3N |
| 廠商： | Altera |
| 文件頁數(shù)： | 2/16頁 |
| 文件大小： | 0K |
| 描述： | IC STRATIX III L 340K 1760-FBGA |
| 產品培訓模塊： | Three Reasons to Use FPGA's in Industrial Designs |
| 標準包裝： | 3 |
| 系列： | Stratix® III |
| LAB/CLB數(shù)： | 13500 |
| 邏輯元件/單元數(shù)： | 337500 |
| RAM 位總計： | 18822144 |
| 輸入/輸出數(shù)： | 1120 |
| 電源電壓： | 0.86 V ~ 1.15 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | 0°C ~ 85°C |
| 封裝/外殼： | 1760-BBGA，F(xiàn)CBGA |
| 供應商設備封裝： | 1760-FCBGA |
1–10
Chapter 1: Stratix III Device Family Overview
Architecture Features
4×, 6×, 7×, 8×, and 10× SERDES modes when using the dedicated DPA circuitry. DPA
minimizes bit errors, simplifies PCB layout and timing management for high-speed
data transfer, and eliminates channel-to-channel and channel-to-clock skew in
high-speed data transmission systems. Soft CDR can also be implemented, enabling
low-cost 1.6-Gbps clock embedded serial links.
Stratix III devices have the following dedicated circuitry for high-speed differential
I/O support:
■
Differential I/O buffer
■
Transmitter serializer
■
Receiver deserializer
■
Data realignment
■
Dynamic phase aligner (DPA)
■
Soft CDR functionality
■
Synchronizer (FIFO buffer)
■
PLLs
f For more information, refer to the High Speed Differential I/O Interfaces with DPA in
Stratix III Devices chapter.
Hot Socketing and Power-On Reset
Stratix III devices are hot-socketing compliant. Hot socketing is also known as hot
plug-in or hot swap, and power sequencing support without the use of any external
devices. Robust on-chip hot-socketing and power-sequencing support ensures proper
device operation independent of the power-up sequence. You can insert or remove a
Stratix III board in a system during system operation without causing undesirable
effects to the running system bus or the board that was inserted into the system.
The hot-socketing feature makes it easier to use Stratix III devices on PCBs that also
contain a mixture of 3.3-V, 3.0-V, 2.5-V, 1.8-V, 1.5-V, and 1.2-V devices. With the
Stratix III hot socketing feature, you do not need to ensure a specific power-up
sequence for each device on the board.
f For more information, refer to the Hot Socketing and Power-On Reset in Stratix III
Devices chapter.
Configuration
Stratix III devices are configured using one of the following four configuration
schemes:
■
Fast passive parallel (FPP)
■
Fast active serial (AS)
■
Passive serial (PS)
■
Joint Test Action Group (JTAG)
All configuration schemes use either an external controller (for example, a MAX II
device or microprocessor), a configuration device, or a download cable.
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| EP3SL340F1760C3NES | 制造商:Altera Corporation 功能描述:IC FPGA 1120 I/O 1760FBGA 制造商:Altera Corporation 功能描述:IC STRATIX III L FPGA 1760FBGA |
| EP3SL340F1760C4 | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP3SL340F1760C4L | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP3SL340F1760C4LN | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| EP3SL340F1760C4N | 功能描述:FPGA - 現(xiàn)場可編程門陣列 FPGA - Stratix III 13500 LABs 1120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256 |
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