參數(shù)資料
型號(hào): ELANSC300-33VI
廠商: Advanced Micro Devices, Inc.
元件分類: 32位微控制器
英文描述: Highly Integrated, Low-Power, 32-Bit Microcontroller
中文描述: 高度集成,低功耗,32位微控制器
文件頁數(shù): 96/139頁
文件大小: 1388K
代理商: ELANSC300-33VI
96
élanSC300 Microcontroller Data Sheet
P R E L I M I N A R Y
model components for a given crystal (i.e., L
1
, C
1
, R
1
,
and C
O
). In addition to these parameters, the manufac-
turer will provide a load capacitance specification usu-
ally designated as C
L
. The load capacitance
specification is the capacitive load at which the manu-
facturer has tuned the crystal for the specified fre-
quency. It is therefore required that the load
capacitance in the oscillator circuit is duplicated as
closely as possible to the manufacturer’s load capaci-
tance specification.
The crystal load capacitance in the circuit consists of
the capacitor network C
O
, C
STRAY
,
C
D
,
and
C
G
. This net-
work reduces to (C
O
+ C
STRAY
) in parallel with the series
combination of C
D
and C
G
. Therefore, the desired se-
ries combination of C
D
and
C
G
is equal to C
L
– (C
O
+
C
STRAY
), where C
L
is the crystal manufacturer’s load ca-
pacitance specification.
C
STRAY
is typically difficult to determine. Some value
can be assumed and experimentation will determine
the optimal value for C
D
and
C
G
. In determining the ex-
ternal component values to provide the optimal operat-
ing frequency, there are some recommended limits to
ensure a reasonable start-up time for the oscillator cir-
cuit. These limits are shown in Table 49.
Table 49.
Recommended Oscillator Component
Value Limits
Minimum
Maximum
R
F
R
B
C
D
C
G
14 M
0
18 M
10 k
10 pF
30 pF
10 pF
30 pF
The series combination of C
D
and C
G
=
C
C
D
(
---------------C
G
C
G
)
+
)
élanSC300 Microcontroller
X32IN (201)
X32OUT (202)
R
F
R
B
L
1
C
1
R
1
C
O
C
D
C
G
A
B
XTAL
C
STRAY
A
B
Notes:
For board layout suggestions, refer to the élanSC300 Microcontroller Evaluation Board User’s Manual available in PDF for-
mat on the AMD web site.
Figure 29.
X32 Oscillator Circuit
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