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| 型號(hào)： | DSPE56007FJ50 |
| 英文描述： | DSP|24-BIT|CMOS|QFP|80PIN|PLASTIC |
| 中文描述： | 數(shù)字信號(hào)處理器| 24位|的CMOS | QFP封裝| 80腳|塑料 |
| 文件頁(yè)數(shù)： | 26/83頁(yè) |
| 文件大?。?/td> | 382K |
| 代理商： | DSPE56007FJ50 |
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2-2
DSP56007/D
MOTOROLA
Specifications
Thermal characteristics
THERMAL CHARACTERISTICS
Table 2-1
Maximum Ratings (GND = 0 V
dc
)
Rating
Symbol
V alue
Unit
Supply Voltage
V
CC
–0.3 to +7.0
V
All Input Voltages
V
IN
I
(GND – 0.25) to (V
CC
+ 0.25)
V
Current Drain per Pin excluding V
CC
and GND
10
mA
Operating Temperature Range:
50 and 66 MHz
88 MHz
T
J
–40 to +125
–40 to +110
°
°
°
C
C
Storage Temperature
T
STG
–55 to +125
C
Table 2-2
Thermal Characteristics
Characteristic
Symbol
QFP V alue
3
QFP V alue
4
Unit
Junction-to-ambient thermal resistance
1
R
θ
JA
or
θ
JA
61.5
37
C/ W
Junction-to-case thermal resistance
2
R
θ
JC
or
θ
JC
11.8
—
C/ W
Thermal characterization parameter
Ψ
JT
2.7
—
C/ W
Notes:
1.
Junction-to-ambient thermal resistance is based on measurements on a horizontal-single-sided
Printed Circuit Board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment
and Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111)
Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-
88, with the exception that the cold plate temperature is used for the case temperature.
These are measured values. See note 1 for test board conditions.
These are measured values; testing is not complete. Values were measured on a non-standard
four-layer thermal test board (two internal planes) at one watt in a horizontal configuration.
2.
3.
4.
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