
External Memory Interface Timing
56852 Technical Data, Rev. 8
Freescale Semiconductor
23
Figure 4-9 External Clock Timing
4.6 External Memory Interface Timing
The External Memory Interface is designed to access static memory and peripheral devices.
Figure 4-10
shows sample timing and parameters that are detailed in
Table 4-7
.
The timing of each parameter consists of both a fixed delay portion and a clock related portion; as well as
user controlled wait states. The equation:
t = D + P * (M + W)
should be used to determine the actual time of each parameter. The terms in the above equation are defined as:
t
parameter delay time
D
fixed portion of the delay, due to on-chip path delays.
P
the period of the system clock, which determines the execution rate of the part (i.e. when the device is
operating at 120 MHz, P = 8.33 ns).
M Fixed portion of a clock period inherent in the design. This number is adjusted to account for possible
clock duty cycle derating.
W the sum of the applicable wait state controls. See the “Wait State Controls” column of
Table 4-7
for
the applicable controls for each parameter. See the EMI chapter of the 83x Peripheral Manual for
details of what each wait state field controls.
Table 4-6 PLL Timing
Operating Conditions: V
SS
= V
SSIO
= V
SSA
= 0V, V
DD
= 1.62-1.98V, V
DDIO
= V
DDA
= 3.0–3.6V, T
A
= –40
°
to +120
°
C, C
L
£ 50pF, f
op
= 120MHz
Characteristic
Symbol
Min
Typ
Max
Unit
External reference crystal frequency for the PLL
1
1.
The PLL is optimized for 4MHz input crystal.
An externally supplied reference clock should be as free as possible from any phase jitter for the PLL to work correctly.
f
osc
2
4
4
MHz
PLL output frequency
f
clk
40
—
240
MHz
PLL stabilization time
2
2.
This is the minimum time required after the PLL setup is changed to ensure reliable operation.
t
plls
—
1
10
ms
External
Clock
V
IH
V
IL
Note: The midpoint is V
IL
+ (V
IH
– V
IL
)/2.
90%
50%
10%
90%
50%
10%
t
PW
t
PW
t
fall
t
rise