參數(shù)資料
型號: CYV15G0404RB-BGXC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: 通信及網(wǎng)絡(luò)
英文描述: Independent Clock Quad HOTLink II⑩ Deserializing Reclocker
中文描述: SPECIALTY TELECOM CIRCUIT, PBGA256
封裝: 27 X 27 MM, 1.57 MM HEIGHT, LEAD FREE, TBGA-256
文件頁數(shù): 26/27頁
文件大?。?/td> 388K
代理商: CYV15G0404RB-BGXC
CYV15G0404RB
Document #: 38-02102 Rev. *C
Page 26 of 27
Cypress Semiconductor Corporation, 2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Ordering Information
HOTLink is a registered trademark and HOTLink II is a trademark of Cypress Semiconductor. All product and company names
mentioned in this document may be the trademarks of their respective holders.
T03
T04
T17
T18
T19
T20
U01
U02
VCC
VCC
VCC
VCC
VCC
VCC
VCC
VCC
POWER
POWER
POWER
POWER
POWER
POWER
POWER
POWER
V15
V16
V17
V18
V19
V20
W01
W02
VCC
VCC
RXDA[9]
RXDA[5]
RXDA[2]
RXDA[1]
VCC
VCC
POWER
POWER
LVTTL OUT
LVTTL OUT
LVTTL OUT
LVTTL OUT
POWER
POWER
Y15
Y16
Y17
Y18
Y19
Y20
VCC
VCC
POWER
POWER
LVTTL OUT
PECL IN
LVTTL OUT
LVTTL OUT
REPDOD
TRGCLKA–
RXDA[8]
RXDA[7]
Table 6. Package Coordinate Signal Allocation
(continued)
Ball
ID
Signal Name
Signal Type
Ball
ID
Signal Name
Signal Type
Ball
ID
Signal Name
Signal Type
Speed
Ordering Code
Package
Name
BL256
BL256
Package Type
Operating
Range
Commercial
Commercial
Standard
Standard
CYV15G0404RB-BGC
CYV15G0404RB-BGXC
256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Package Diagram
Figure 3. 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
A
B
0.15
C
0.15
C
0.97 REF.
0.60±0.10
1.57±0.175
C
0.20 MIN
TOP OF MOLD COMPOUND
TO TOP OF BALLS
SEATING PLANE
SIDE VIEW
SECTION A-A
TOP VIEW
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
0.15 M C
0.30 M C
0.75±0.15(256X)
B
A
1
BOTTOM VIEW (BALL SIDE)
A
0.20(4X)
26°
TYP
A1 CORNER I.D.
0.50 MIN.
2
27.00±0.13
2
24.13
A1 CORNER I.D.
R 2.5 Max (4X)
1
51-85123-*E
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