參數(shù)資料
型號(hào): CY7C1392BV18-167BZC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
中文描述: 2M X 8 DDR SRAM, 0.5 ns, PBGA165
封裝: 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁(yè)數(shù): 9/27頁(yè)
文件大?。?/td> 446K
代理商: CY7C1392BV18-167BZC
CY7C1392BV18
CY7C1992BV18
CY7C1393BV18
CY7C1394BV18
Document Number: 38-05623 Rev. *C
Page 9 of 27
Truth Table
[2, 3, 4, 5, 6, 7]
Operation
K
LD
L
R/W
L
DQ
DQ
Write Cycle:
Load address; wait one cycle; input write data on
consecutive K and K rising edges.
Read Cycle:
Load address; wait one and a half cycle; read data
on consecutive C and C rising edges.
NOP: No Operation
Standby: Clock Stopped
L-H
D(A + 0) at K(t + 1)
D(A + 1) at K(t + 1)
L-H
L
H
Q(A + 0) at C(t + 1)
Q(A + 1) at C(t + 2)
L-H
H
X
X
X
High-Z
Previous State
High-Z
Previous State
Stopped
Write Cycle Descriptions
(CY7C1392BV18 and CY7C1393BV18)
[2, 8]
BWS
0
/NWS
0
L
BWS
1
/NWS
1
L
K
K
-
Comments
L-H
During the Data portion of a Write sequence
:
CY7C1392BV18
both nibbles (D
[7:0]
) are written into the device,
CY7C1393BV18
both bytes (D
[17:0]
) are written into the device.
L-H During the Data portion of a Write sequence
:
CY7C1392BV18
both nibbles (D
[7:0]
) are written into the device,
CY7C1393BV18
both bytes (D
[17:0]
) are written into the device.
-
During the Data portion of a Write sequence
:
CY7C1392BV18
only the lower nibble (D
[3:0]
) is written into the device. D
[7:4]
will remain unaltered,
CY7C1393BV18
only the lower byte (D
[8:0]
) is written into the device. D
[17:9]
will remain unaltered.
L-H During the Data portion of a Write sequence
:
CY7C1392BV18
only the lower nibble (D
[3:0]
) is written into the device. D
[7:4]
will remain unaltered,
CY7C1393BV18
only the lower byte (D
[8:0]
) is written into the device. D
[17:9]
will remain unaltered.
During the Data portion of a Write sequence
:
CY7C1392BV18
only the upper nibble (D
[7:4]
) is written into the device. D
[3:0]
will remain unaltered,
CY7C1393BV18
only the upper byte (D
[17:9]
) is written into the device. D
[8:0]
will remain unaltered.
L-H During the Data portion of a Write sequence
:
CY7C1392BV18
only the upper nibble (D
[7:4]
) is written into the device. D
[3:0]
will remain unaltered,
CY7C1393BV18
only the upper byte (D
[17:9]
) is written into the device. D
[8:0]
will remain unaltered.
No data is written into the devices during this portion of a Write operation.
L-H No data is written into the devices during this portion of a Write operation.
L
L
-
L
H
L-H
L
H
-
H
L
L-H
H
L
H
H
H
H
L-H
Notes:
2. X = “Don't Care,” H = Logic HIGH, L = Logic LOW,
represents rising edge.
3. Device will power-up deselected and the outputs in a tri-state condition.
4. “A” represents address location latched by the devices when transaction was initiated. A + 0, A + 1 represents the internal address sequence in the burst.
5. “t” represents the cycle at which a Read/Write operation is started. t+1, t + 2 and t +3 are the first, second and third clock cycles succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line
charging symmetrically.
8. Assumes a Write cycle was initiated per the Write Cycle Description Truth Table. BWS
, BWS
in the case of CY7C1392BV18 and CY7C1393BV18 and also
BWS
2
, BWS
3
in the case of CY7C1394BV18 can be altered on different portions of a write cycle, as long as the set-up and hold requirements are achieved.
[+] Feedback
相關(guān)PDF資料
PDF描述
CY7C1393BV18-300BZXC 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1393BV18-300BZXI 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1394BV18-167BZC 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1394BV18-167BZI 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
CY7C1394BV18-167BZXC 18-Mbit DDR-II SIO SRAM 2-Word Burst Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1392CV18-200BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx8 1.8V DDR II SIO 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1392CV18-250BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 2Mx8 1.8V DDR II SIO 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1392KV18-250BZXC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 18Mb DDR II SIO 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1392SC 制造商:Cypress Semiconductor 功能描述:
CY7C1392SV18-250BZC 功能描述:IC SRAM 2MX8 DDRII 165-FBGA RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)