參數(shù)資料
型號(hào)： C3ENPB0-DS
英文描述： 4 Mbit (512 Kbit x 8) ZEROPOWER® SRAM
中文描述： ? - 3E的網(wǎng)絡(luò)處理器的數(shù)據(jù)資料硅修訂買0
文件頁數(shù)： 76/114頁
文件大小： 1893K
代理商： C3ENPB0-DS
76
CHAPTER 3: ELECTRICAL SPECIFICATIONS
C3ENPA1-DS/D REV 03
MOTOROLA GENERAL BUSINESS INFORMATION
large mass of the heat sink, attachment through the printed circuit board is suggested. If a
spring clip is used, the spring force should not exceed 5.5 pounds.
Figure 10
Package Cross Section View with Serveral Heat Sink Options
Internal Package Conduction Resistance
For the exposed-die packaging technology the intrinsic conduction thermal resistance
paths are as follows:
The die junction-to-case (or top-of-die for exposed silicon) thermal resistance
The die junction-to-ball thermal resistance
Figure 11
depicts the primary heat transfer path for a package with an attached heat sink
mounted to a printed-circuit board.
CBGA Package
Heat Sink
Heat Sink Clip
Thermal Interface Material
Printed Circuit Board
F
n
.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
C3F 功能描述:XLR 連接器 3 PIN FEMALE RECEPT RoHS:否 制造商:Neutrik 標(biāo)準(zhǔn):Standard XLR 產(chǎn)品類型:Connectors 型式:Female 位置/觸點(diǎn)數(shù)量:3 端接類型:Solder 安裝風(fēng)格:Cable 方向:Vertical
C3F002KBS 制造商:Hammond Power Solutions 功能描述:TRANSFORMER, DISTRIBUTION , ENCAPSULATED, 480V IN, 208Y/120V OUT, 2KVA
C3F002KDS 制造商:Hammond Power Solutions 功能描述:POTTED N3R 3PH CU 2kVA 480-240
C3F003DKS 制造商:Hammond Power Solutions 功能描述:TRANSFORMER, N3R 3PH 3KVA 240-480Y/277
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