- 您現(xiàn)在的位置：買(mǎi)賣(mài)IC網(wǎng) > PDF目錄298893 > BXM80526B700128 (INTEL CORP) 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 PDF資料下載
參數(shù)資料
| 型號(hào)： | BXM80526B700128 |
| 廠商： | INTEL CORP |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| 封裝： | MICRO, PGA2-495 |
| 文件頁(yè)數(shù)： | 52/74頁(yè) |
| 文件大?。?/td> | 870K |
| 代理商： | BXM80526B700128 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)當(dāng)前第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)
Mobile Intel Celeron Processor (0.18) in BGA2 and Micro-PGA2 Packages
at 700MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, 450 MHz,
Low-voltage 500 MHz, and Low-voltage 400A MHz
Datasheet
Order#-XXX
49
6.1
Thermal Diode
The mobile Celeron processor has an on-die thermal diode that can be used to monitor the die
temperature(TJ). A thermal sensor located on the motherboard, or a stand-alone measurement kit,
may monitor the die temperature of the processor for thermal management or instrumentation
purposes. Table 33 and Table 34 provide the diode interface and specifications.
Note: The reading of the thermal sensor connected to the thermal diode will not necessarily reflect
the temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor,
on-die temperature gradients between the location of the thermal diode and the hottest location on
the die, and time based variations in the die temperature measurement. Time based variations can
occur when the sampling rate of the thermal diode (by the thermal sensor) is slower than the rate at
which the TJ temperature can change.
Table 33. Thermal Diode Interface
Signal Name
Pin/Ball Number
Signal Description
THERMDA
AA15
Thermal diode anode
THERMDC
AB16
Thermal diode cathode
Table 34. Thermal Diode Specifications
Symbol
Parameter
Min
Typ
Max
Unit Notes
IFW
Forward Bias Current
5
500
A
Note 1
n
Diode Ideality Factor
1.0057 1.0080 1.0125
Notes 2, 3, 4
NOTES:
1.
Intel does not support or recommend operation of the thermal diode under reverse bias. Intel does not support or
recommend operation of the thermal diode when the processor power supplies are not within their specified tolerance
range.
2.
Characterized at 100°C.
3.
Not 100% tested. Specified by design/characterization.
4.
The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode equation: Where Is =
saturation current, q = electronic charge, Vd = voltage across the diode, k = Boltzmann Constant, and T = absolute
temperature (Kelvin).
=
1
q
S
FW
nkT
VD
e
I
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| BXM80526B700 | 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495 |
| BXM80536GC2100F | 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478 |
| BXM80536GC1800F | 32-BIT, 1800 MHz, MICROPROCESSOR, CPGA478 |
| BXM80536GC1600F | 32-BIT, 1600 MHz, MICROPROCESSOR, CPGA478 |
| BYP60K4 | 60 A, 400 V, SILICON, RECTIFIER DIODE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| BXM80536NC1400ES L7LS | 制造商:Intel 功能描述:CELERON M,360,1.40GHZ,1M CACHE, 400MHZ FSB,1.26V,UFCPGA - Boxed Product (Development Kits) |
| BXMP1000 | 制造商:SPECTRUM 制造商全稱(chēng):Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1001 | 制造商:SPECTRUM 制造商全稱(chēng):Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1002 | 制造商:SPECTRUM 制造商全稱(chēng):Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
| BXMP1003 | 制造商:SPECTRUM 制造商全稱(chēng):Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。