參數(shù)資料
型號(hào)： BXM80526B700128
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
封裝： MICRO, PGA2-495
文件頁(yè)數(shù)： 37/74頁(yè)
文件大?。?/td> 870K
代理商： BXM80526B700128
Mobile Intel Celeron Processor (0.18) in BGA2 and Micro-PGA2 Packages
at 700MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, 450 MHz,
Low-voltage 500 MHz, and Low-voltage 400A MHz
Datasheet
Order#-XXX
35
5.0
Mechanical Specifications
5.1
Surface-mount BGA2 Package Dimensions
The mobile Celeron processor is packaged in a PBGA-B495 package (also known as BGA2) with
the back of the processor die exposed on top. Unlike previous mobile processors with exposed die,
the back of the mobile Celeron processor die may be polished and very smooth. The mechanical
specifications for the surface-mount package are provided in Table 27. Figure 19 shows the top
and side views of the surface-mount package, and Figure 20 shows the bottom view of the surface-
mount package. The substrate may only be contacted within the shaded region between the keep-
out outline and the edge of the substrate. The mobile Celeron processor will have one or two label
marks. These label marks will be located along the long edge of the substrate outside of the keep-
out region and they will not encroach upon the 7-mm by 7-mm squares at the substrate corners.
Please note that in order to implement VID on the BGA2 package, some VID[4:0] balls may be
depopulated.
Table 27. Surface-mount BGA2 Package Specifications
Symbol
Parameter
Min
Max
Unit
A
Overall Height, as delivered
2.29
2.79
mm
A1
Substrate Height, as delivered
1.50 REF
mm
A2
Die Height
0.854 REF
mm
b
Ball Diameter
0.78 REF
mm
D
Package Width
27.05
27.35
mm
D1
Die Width
8.81 REF (CPUID = 0686h)
9.28 REF (CPUID = 0683h)
9.37 REF (CPUID = 0681h)
mm
E
Package Length
30.85
31.15
mm
e
Ball Pitch
1.27
mm
E1
Die Length
10.79 REF (CPUID = 0686h)
11.23 REF (CPUID = 0683h)
11.27 REF (CPUID = 0681h)
mm
N
Ball Count
495
each
S1
Outer Ball Center to Short Edge of Substrate
0.895 REF
mm
S2
Outer Ball Center to Long Edge of Substrate
0.900 REF
mm
PDIE
Allowable Pressure on the Die for Thermal Solution
—
689
kPa
W
Package Weight
4.5 REF
grams
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