參數(shù)資料
型號(hào)： BXM80526B600256
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 600 MHz, MICROPROCESSOR, CPGA495
封裝： MICRO PGA-495
文件頁數(shù)： 61/84頁
文件大?。?/td> 450K
代理商： BXM80526B600256
Mobile Pentium III Processor in BGA2 and Micro-PGA2 Packages Datasheet
Intel Corporation
56
Table 35. Power Specifications for Fixed Frequency Mobile Pentium III Processor
Symbol
Parameter
Min
Typ
1
Max
Unit
Notes
TDP
Thermal Design Power
at 400 MHz & 1.35V
at 450 MHz & 1.6V
at 500 MHz & 1.35V
at 500 MHz & 1.6V
—
10.1
15.5
12.2
16.8
W
at 100°C, Notes 2, 3
PSGNT
Stop Grant and Auto Halt power
—
1.1
W
at 50°C, Notes 3,4
PQS
Quick Start and Sleep power
—
650
mW
at 50°C, Notes 3,4
PDSLP
Deep Sleep power
—
150
mW
at 35°C, Notes 3,4
TJ
Junction Temperature
0
100
°C
Note 5
NOTES:
1.
TDPTYP is a recommendation based on the power dissipation of the processor while executing publicly available software
under normal operating conditions at nominal voltages. Contact your Intel Field Sales Representative for further
information.
2.
TDPMAX is a specification of the total power dissipation of the processor while executing a worst-case instruction mix under
normal operating conditions at nominal voltages. It includes the power dissipated by all of the components within the
processor. Not 100% tested. Specified by design/characterization.
3.
Not 100% tested or guaranteed. The power specifications are composed of the current of the processor on the various
voltage planes. These currents are measured and specified at high temperature Table 10. These power specifications are
determined by characterization of the processor currents at higher temperatures.
4.
For PSGNT, PQS, and PDSLP specifications in the case of 500MHz at 1.35V fixed frequency processor, refer to these values
listed in Table 34 at 1.35V.
5.
TJ is measured with the on-die thermal diode. The recommended method for accurately measuring TJ is detailed in the
Intel Mobile Pentium III Processor Thermal Specification Guidelines.
6.1
Thermal Diode
The mobile PentiumIII processor has an on-die thermal diode that can be used to monitor the die
temperature(TJ). A thermal sensor located on the motherboard, or a stand-alone measurement kit,
may monitor the die temperature of the processor for thermal management or instrumentation
purposes. Table 36 and Table 37 provide the diode interface and specifications.
Note: The reading of the thermal sensor connected to the thermal diode will not necessarily reflect
the temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor,
on-die temperature gradients between the location of the thermal diode and the hottest location on
the die, and time based variations in the die temperature measurement. Time based variations can
occur when the sampling rate of the thermal diode (by the thermal sensor) is slower than the rate at
which the TJ temperature can change. Refer to the Intel Mobile Pentium III Processor Thermal
Specification Guideline for more details .
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