參數(shù)資料
型號(hào)： BXM80526B600256
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 600 MHz, MICROPROCESSOR, CPGA495
封裝： MICRO PGA-495
文件頁(yè)數(shù)： 23/84頁(yè)
文件大?。?/td> 450K
代理商： BXM80526B600256
Mobile Pentium III Processor in BGA2 and Micro-PGA2 Packages Datasheet
Intel Corporation
i
CONTENTS
1.0
Introduction .................................................................................................. 1
1.1
Overview............................................................................................ 4
1.2
Terminology ....................................................................................... 4
1.3
References......................................................................................... 5
2.0
Mobile Pentium III Processor Features......................................................... 6
2.1
New Features in the Mobile Pentium III Processor ................................ 6
2.1.1
On-die GTL+ Termination........................................................ 6
2.1.2
Streaming SIMD Extensions .................................................... 6
2.1.3
Intel SpeedStep Technology .................................................... 6
2.1.4
Signal Differences Between the Mobile Pentium II Processor
and the Mobile Pentium III Processor........................................ 6
2.2
Power Management ............................................................................ 7
2.2.1
Clock Control Architecture ....................................................... 7
2.2.2
Normal State .......................................................................... 7
2.2.3
Auto Halt State ....................................................................... 7
2.2.4
Stop Grant State..................................................................... 8
2.2.5
Quick Start State .................................................................... 9
2.2.6
HALT/Grant Snoop State......................................................... 9
2.2.7
Sleep State............................................................................. 9
2.2.8
Deep Sleep State.................................................................. 10
2.2.9
Operating System Implications of Low-power States ............... 10
2.2.10 Intel SpeedStep Technology .................................................. 10
2.3
GTL+ Signals ................................................................................... 11
2.4
Mobile Pentium III Processor CPUID.................................................. 11
3.0
Electrical Specifications.............................................................................. 12
3.1
Processor System Signals................................................................. 12
3.1.1
Power Sequencing Requirements .......................................... 13
3.1.2
Test Access Port (TAP) Connection....................................... 13
3.1.3
Catastrophic Thermal Protection ............................................ 14
3.1.4
Unused Signals .................................................................... 14
3.1.5
Signal State in Low-power States........................................... 14
3.1.5.1
System Bus Signals ............................................. 14
3.1.5.2
CMOS and Open-drain Signals ............................. 14
3.1.5.3
Other Signals ....................................................... 15
3.2
Power Supply Requirements ............................................................. 15
3.2.1
Decoupling Recommendations .............................................. 15
3.2.2
Voltage Planes ..................................................................... 15
3.3
System Bus Clock and Processor Clocking......................................... 16
3.4
Intel SpeedStep Technology .............................................................. 16
3.5
Maximum Ratings ............................................................................. 16
3.6
DC Specifications ............................................................................. 17
3.7
AC Specifications.............................................................................. 21
3.7.1
System Bus, Clock, APIC, TAP, CMOS, and Open-drain AC
Specifications ....................................................................... 21
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