參數(shù)資料
型號(hào)： AD9912ABCPZ-REEL7
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 17/40頁(yè)
文件大小： 0K
描述： IC DDS 1GSPS DAC 14BIT 64LFCSP
產(chǎn)品培訓(xùn)模塊： Direct Digital Synthesis Tutorial Series (1 of 7): Introduction
Direct Digital Synthesizer Tutorial Series (7 of 7): DDS in Action
Direct Digital Synthesis Tutorial Series (3 of 7): Angle to Amplitude Converter
Direct Digital Synthesis Tutorial Series (6 of 7): SINC Envelope Correction
Direct Digital Synthesis Tutorial Series (4 of 7): Digital-to-Analog Converter
Direct Digital Synthesis Tutorial Series (2 of 7): The Accumulator
標(biāo)準(zhǔn)包裝： 750
分辨率（位）： 14 b
主 fclk： 1GHz
調(diào)節(jié)字寬（位）： 48 b
電源電壓： 1.8V, 3.3V
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 64-VFQFN 裸露焊盤(pán)，CSP
供應(yīng)商設(shè)備封裝： 64-LFCSP-VQ（9x9）
包裝： 帶卷 (TR)
AD9912
Rev. F | Page 24 of 40
THERMAL PERFORMANCE
Table 7. Thermal Parameters
Symbol
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Value
Unit
θJA
Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)
25.2
°C/W
θJMA
Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)
22.0
°C/W
θJMA
Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)
19.8
°C/W
θJB
Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)
13.9
°C/W
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
1.7
°C/W
ΨJT
Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)
0.1
°C/W
The AD9912 is specified for a case temperature (TCASE). To
ensure that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera-
ture on the application PCB:
TJ
= TCASE + (ΨJT × PD)
where:
TJ
is the junction temperature (°C).
TCASE
is the case temperature (°C) measured by customer at top
center of package.
ΨJT
is the value from Table 7.
PD
is the power dissipation (see the Total Power Dissipation
section in the Specifications section).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ
= TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
The values in Table 7 apply to both 64-lead package options.
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