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參數(shù)資料
| 型號： | A81L801TG-70IF |
| 廠商： | AMIC Technology Corporation |
| 英文描述： | Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| 中文描述： | 堆疊式多芯片封裝（MCP）1的MX 8位/ 16位為512k ×引導扇區(qū)閃存和128K × 8 SRAM的低電壓的CMOS |
| 文件頁數(shù)： | 47/47頁 |
| 文件大?。?/td> | 705K |
| 代理商： | A81L801TG-70IF |
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A81L801
PRELIMINARY (March, 2005, Version 0.0)
46
AMIC Technology, Corp.
Package Information
69LD STF BGA (8 x 11mm) Outline Dimensions
unit: mm
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
-A-
-B-
Pin #1
D
E
aaa
aaa
See Detail A
9 10
D
1
e
E
1
-C-
ccc C
CAVITY
SEATING PLANE
SOLDER BALL
c
A
1
A
2
A
1
2
3
A
B
C
See Detail B
b
Detail A
Detail B
C
ddd
eee
M
C
M
A B
// bbb C
Dimensions in mm
Min
Nom
-
0.25
0.30
0.91
0.96
0.22
0.26
7.90
8.00
10.90
11.00
-
7.20
-
7.20
-
0.80
0.35
0.40
0.15
0.20
0.12
0.15
0.08
10/10
Dimensions in inches
Min
Nom
-
-
0.010
0.012
0.036
0.038
0.009
0.010
0.311
0.315
0.429
0.433
-
0.283
-
0.283
-
0.031
0.14
0.16
0.006
0.008
0.005
0.006
0.003
10/10
Symbol
Max
1.40
0.35
1.01
0.30
8.10
11.10
-
-
-
0.45
Max
0.055
0.014
0.040
0.012
0.319
0.437
-
-
-
0.18
A
A
1
A
2
c
D
E
D1
E1
e
b
aaa
bbb
ccc
ddd
eee
MD/ME
-
Notes:
1. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
2. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL
DIAMETER, PARALLEL TO PRIMARY DATUM C.
3. THERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE
EDGE OF THE SOLDER BALL AND THE BODY EDGE.
4. REFERENCE DOCUMENT : JEDEC MO-219
5. THE PATTERN OF PIN 1 FIDUCIAL IS FOR REFERENCE ONLY.
相關PDF資料 |
PDF描述 |
|---|---|
| A81L801UG-70 | Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A81L801UG-70F | Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A81L801UG-70I | Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A81L801UG-70IF | Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A8205SLH-XX | LOW-DROPOUT REGULATORS - HIGH EFFICIENCY |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| A81L801UG-70 | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A81L801UG-70F | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A81L801UG-70I | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A81L801UG-70IF | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-chip Package (MCP) 1 M X 8 Bit / 512K X 16 Bit Boot Sector Flash Memory and 128K x 8 Low Voltage CMOS SRAM |
| A-81X | 制造商:Triad Magnetics 功能描述: |
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