參數(shù)資料
型號(hào): XRM48L950PGET
廠商: Texas Instruments
文件頁(yè)數(shù): 158/176頁(yè)
文件大?。?/td> 0K
描述: MCU 16/32Bit FLASH 3MB 144LQFP
標(biāo)準(zhǔn)包裝: 1
系列: Hercules™ ARM® RM4x
應(yīng)用: 工業(yè)安全,醫(yī)療
核心處理器: ARM? Cortex? - R4F
程序存儲(chǔ)器類型: 閃存(3MB)
控制器系列: RM4
RAM 容量: 256K x 8
接口: CAN,以太網(wǎng),I²C,LIN,MibSPI,SCI,SPI,USB
輸入/輸出數(shù): 64
電源電壓: 1.14 V ~ 3.6 V
工作溫度: -40°C ~ 105°C
安裝類型: 表面貼裝
封裝/外殼: 144-LQFP
包裝: 托盤
供應(yīng)商設(shè)備封裝: 144-LQFP(20x20)
其它名稱: 296-29389
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)當(dāng)前第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)
SPNS174A – APRIL 2012 – REVISED SEPTEMBER 2013
4.10.2 Main Features of Flash Module
Support for multiple flash banks for program and/or data storage
Simultaneous read access on a bank while performing program or erase operation on any other bank
Integrated state machines to automate flash erase and program operations
Software interface for flash program and erase operations
Pipelined mode operation to improve instruction access interface bandwidth
Support for Single Error Correction Double Error Detection (SECDED) block inside Cortex-R4F CPU
Error address is captured for host system debugging
Support for a rich set of diagnostic features
4.10.3 ECC Protection for Flash Accesses
All accesses to the program flash memory are protected by Single Error Correction Double Error Detection
(SECDED) logic embedded inside the CPU. The flash module provides 8 bits of ECC code for 64 bits of
instructions or data fetched from the flash memory. The CPU calculates the expected ECC code based on
the 64 bits received and compares it with the ECC code returned by the flash module. A signle-bit error is
corrected and flagged by the CPU, while a multi-bit error is only flagged. The CPU signals an ECC error
via its Event bus. This signaling mechanism is not enabled by default and must be enabled by setting the
"X" bit of the Performance Monitor Control Register, c9.
MRC p15,#0,r1,c9,c12,#0
;Enabling Event monitor states
ORR r1, r1, #0x00000010
MCR p15,#0,r1,c9,c12,#0
;Set 4th bit (‘X’) of PMNC register
MRC p15,#0,r1,c9,c12,#0
The application must also explicitly enable the CPU's ECC checking for accesses on the CPU's ATCM
and BTCM interfaces. These are connected to the program flash and data RAM respectively. ECC
checking for these interfaces can be done by setting the B1TCMPCEN, B0TCMPCEN and ATCMPCEN
bits of the System Control coprocessor's Auxiliary Control Register, c1.
MRC p15, #0, r1, c1, c0, #1
ORR r1, r1, #0x0e000000
;Enable ECC checking for ATCM and BTCMs
DMB
MCR p15, #0, r1, c1, c0, #1
4.10.4 Flash Access Speeds
For information on flash memory access speeds and the relevant wait states required, refer to Section 3.4.
4.10.5 Flash Program and Erase Timings for Program Flash
Table 4-23. Timing Specifications for Program Flash
Parameter
MIN
NOM
MAX
Unit
tprog (144bit)
Wide Word (144bit) programming time
40
300
s
tprog (Total)
3MByte programming time(1)
-40°C to 105°C
32
s
0°C to 60°C, for first
8
16
s
25 cycles
terase
Sector/Bank erase time(2)
-40°C to 105°C
0.03
4
s
0°C to 60°C, for first
16
100
ms
25 cycles
twec
Write/erase cycles with 15 year Data Retention
-40°C to 105°C
1000
cycles
requirement
(1)
This programming time includes overhead of state machine, but does not include data transfer time. The programming time assumes
programming 144 bits at a time at the maximum specified operating frequency.
(2)
During bank erase, the selected sectors are erased simultaneously. The time to erase the bank is specified as equal to the time to erase
a sector.
82
System Information and Electrical Specifications
Copyright 2012–2013, Texas Instruments Incorporated
Product Folder Links: RM48L950 RM48L750 RM48L550
相關(guān)PDF資料
PDF描述
FF02S27SV1 CONN FFC/FPC 0.3MM 27POS R/A SMD
395-026-524-202 CARD EDGE 26POS DL .100X.200 BLK
395-026-524-201 CARD EDGE 26POS DL .100X.200 BLK
395-026-523-804 CARD EDGE 26POS DL .100X.200 BLK
395-026-523-802 CARD EDGE 26POS DL .100X.200 BLK
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XRM48L950ZWTT 功能描述:ARM微控制器 - MCU HERCULES MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
XRM48L952PGET 功能描述:ARM微控制器 - MCU 16/32B RISC Fl. MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
XRM48L952ZWTT 功能描述:ARM微控制器 - MCU 16/32B RISC Fl. MCU RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:72 MHz 程序存儲(chǔ)器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT
XRMQ108D00 制造商:TE Connectivity 功能描述:
XRMQ208K005+01 制造商:TE Connectivity 功能描述: