Spartan-3E FPGA Family: DC and Switching Characteristics
DS312 (v4.1) July 19, 2013
Product Specification
155
Revision History
The following table shows the revision history for this document.
Date
Version
Revision
03/01/2005
1.0
Initial Xilinx release.
11/23/2005
2.0
Added AC timing information and additional DC specifications.
03/22/2006
3.0
Upgraded data sheet status to Preliminary. Finalized production timing parameters. All speed grades
for all Spartan-3E FPGAs are now Production status using the v1.21 speed files, as shown in
Table 84.
Expanded description in Note 2,
Table 78. Updated pin-to-pin and clock-to-output timing based on final
characterization, shown in
Table 86. Updated system-synchronous input setup and hold times based
Provided input and output adjustments for LVPECL_25, DIFF_SSTL and DIFF_HSTL I/O standards
that supersede the v1.21 speed file values, in
Table 91 and
Table 94. Reduced I/O three-state and
set/reset delays in Table 93. Added XC3S100E FPGA in CP132 package to Table 96. Increased TAS slice flip-flop timing by 100 ps in
Table 98. Updated distributed RAM timing in
Table 99 and SRL16
timing in
Table 100. Updated global clock timing, removed left/right clock buffer limits in
Table 101.
Updated block RAM timing in
Table 103. Added DCM parameters for remainder of Step 0 device;
minimum INIT_B pulse width specification, TINIT, in Table 111. Increased data hold time for Slave Parallel mode to 1.0 ns (TSMCCD) in Table 117. Improved the DCM performance for the XC3S1200E, 04/07/2006
3.1
Improved SSO limits for LVDS_25, MINI_LVDS_25, and RSDS_25 I/O standards in the QFP packages
05/19/2006
3.2
Clarified that 100 mV of hysteresis applies to LVCMOS33 and LVCMOS25 I/O standards (Note 4,
05/30/2006
3.2.1
Corrected various typos and incorrect links.
11/09/2006
3.4
Improved absolute maximum voltage specifications in
Table 73, providing additional overshoot
allowance. Widened the recommended voltage range for PCI and PCI-X standards in
Table 80.Clarified Note 2,
Table 83. Improved various timing specifications for v1.26 speed file. Added
Table 85to summarize the history of speed file releases after which time all devices became Production status.
Table 89 about source-synchronous input capture sample window. Promoted Module 3 to Production
status. Synchronized all modules to v3.4.
03/16/2007
3.5
Based on extensive 90 nm production data, improved (reduced) the maximum quiescent current limits
for the ICCINTQ, ICCAUXQ, and ICCOQ specifications in Table 79 by an average of 50%. 05/29/2007
3.6
Added note to Table 74 and Table 75 regarding HSWAP in step 0 devices. Updated tRPW_CLB in Table 98 to match value in speed file. Improved CLKOUT_FREQ_CLK90 to 200 MHz for Stepping 1 in
04/18/2008
3.7
Clarified that Stepping 0 was offered only for -4C and removed Stepping 0 -5 specifications. Added
reference to XAPP459 in Table 73 and Table 77. Improved recommended max VCCO to 3.465V (3.3V + 5%) in
Table 77. Removed minimum input capacitance from
Table 78. Updated Recommended
Operating Conditions for LVCMOS and PCI I/O standards in
Table 80. Removed Absolute Minimums
minimum values. Updated TPSFD and TPHFD in Table 87 to match current speed file. Update TRPW_IOB in
Table 88 to match current speed file and CLB equivalent spec. Added XC3S500E VQG100 to
08/26/2009
3.8
Table 120. Removed VREF requirements for differential HSTL and differential SSTL in Table 95. Added Spread Spectrum paragraph. Revised hold times for TIOICKPD in Table 88 and setup times for TDICK in input jitter.