參數(shù)資料
型號(hào)： W947D6HBHX6E
廠(chǎng)商： WINBOND ELECTRONICS CORP
元件分類(lèi)： DRAM
英文描述： 8M X 16 DDR DRAM, 5 ns, PBGA60
封裝： 8 X 9 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-60
文件頁(yè)數(shù)： 51/60頁(yè)
文件大?。?/td> 1160K
代理商： W947D6HBHX6E
W947D6HB / W947D2HB
128Mb Mobile LPDDR
Publication Release Date:Jun,17, 2011
- 55 -
Revision A01-003
8.5.2 Output Slew Rate Characteristics
PARAMETER
MIN
MAX
UNIT
NOTES
Pull-up and Pull-Down Slew Rate for Full Strength Driver
0.7
2.5
V/ns
1,2
Pull-up and Pull-Down Slew Rate for Three-Quarter Strength Driver
0.5
1.75
V/ns
1,2
Pull-up and Pull-Down Slew Rate for Half Strength Driver
0.3
1.0
V/ns
1,2
Output Slew rate Matching ratio (Pull-up to Pull-down)
0.7
1.4
-
3
Notes:
1.
Measured with a test load of 20 pF connected to VSSQ.
2.
Output slew rate for rising edge is measured between VILD(DC) to VIHD(AC) and for falling edge between VIHD(DC) to VILD(AC).
3.
The ratio of pull-up slew rate to pull-down slew rate is specified for the same temperature and voltage, over the entire temperature and
voltage range. For a given output, it represents the maximum difference between pull-up and pull-down drivers due to process variation.
8.5.3 AC Overshoot/Undershoot Specification
PARAMETER
SPECIFICATION
Maximum peak amplitude allowed for overshoot
0.5 V
Maximum peak amplitude allowed for undershoot
0.5 V
The area between overshoot signal and VDD must be less than or equal to
3 V-ns
The area between undershoot signal and GND must be less than or equal to
3 V-ns
8.5.4 AC Overshoot and Undershoot Definition
VDD
VSS
2.5
2.0
1.5
1.0
0.5
0
-0.5
Overshoot Area
Undershoot Area
Max Amplitude = 0.5V
Max Area = 3V-ns
V
o
lta
g
e
(V
)
Time
(ns)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W947D6HBHX6G 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:128Mb Mobile LPDDR
W948D2FB 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:256Mb Mobile LPDDR
W948D2FBJX5E 功能描述:IC LPDDR SDRAM 256MBIT 90VFBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:閃存 - NAND 存儲(chǔ)容量:4G（256M x 16） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:0°C ~ 70°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP I 包裝:Digi-Reel® 其它名稱(chēng):557-1461-6
W948D2FBJX5ETR 制造商:Winbond Electronics Corp 功能描述:256M MDDR, X32, 200MHZ
W948D2FBJX5I 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR SDRAM 256M-Bit 8Mx32 1.8V 90-Pin VFBGA 制造商:Winbond Electronics Corp 功能描述:IC MEMORY
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