參數(shù)資料
型號: W25Q32BVSFIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDSO16
封裝: 0.300 INCH, GREEN, SOIC-16
文件頁數(shù): 24/79頁
文件大?。?/td> 1090K
代理商: W25Q32BVSFIG
W25Q32BV
- 30 -
7.2.13 Fast Read Quad Output (6Bh)
The Fast Read Quad Output (6Bh) instruction is similar to the Fast Read Dual Output (3Bh) instruction
except that data is output on four pins, IO0, IO1, IO2, and IO3. A Quad enable of Status Register-2 must be
executed before the device will accept the Fast Read Quad Output Instruction (Status Register bit QE
must equal 1). The Fast Read Quad Output Instruction allows data to be transferred from the W25Q32BV
at four times the rate of standard SPI devices.
The Fast Read Quad Output instruction can operate at the highest possible frequency of FR (see AC
Electrical Characteristics). This is accomplished by adding eight “dummy” clocks after the 24-bit address
as shown in Figure 12. The dummy clocks allow the device's internal circuits additional time for setting up
the initial address. The input data during the dummy clocks is “don’t care”. However, the IO pins should be
high-impedance prior to the falling edge of the first data out clock.
/CS
CLK
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (6Bh)
High Impedance
8
9
10
28
29
30
32
33
34
35
36
37
38
39
4
0
24-Bit Address
23
22
21
3
2
1
0
*
31
/CS
CLK
Dummy Clocks
0
40
41
42
43
44
45
46
47
5
1
High Impedance
4
5
High Impedance
6
2
7
3
High Impedance
4
0
5
1
6
2
7
3
4
0
5
1
6
2
7
3
4
0
5
Byte 1
6
7
1
6
2
7
3
Byte 2
Byte 3
Byte 4
IO
0 switches from
Input to Output
IO
0
IO
1
IO
2
IO
3
IO
0
IO
1
IO
2
IO
3
= MSB
*
Figure 12. Fast Read Quad Output Instruction Sequence Diagram
相關(guān)PDF資料
PDF描述
W3EG6466S335BD4S 64M X 64 DDR DRAM MODULE, 0.7 ns, DMA200
WEDF1M32B-70G2UC5A 1M X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68
WE128K32P-140G2TI 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
WE128K32P-150G2TQA 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
W7NCF01GH31IS6BG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q32BVSFIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSSAG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSSAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSSIG 功能描述:IC SPI FLASH 32MBIT 8SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)
W25Q32BVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 32M-BIT, 4KB UNIFORM