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參數(shù)資料
| 型號(hào)： | W25Q32BVDAAP |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 32M X 1 SPI BUS SERIAL EEPROM, PDIP8 |
| 封裝： | 0.300 INCH, GREEN, PLASTIC, DIP-8 |
| 文件頁數(shù)： | 77/79頁 |
| 文件大小： | 1090K |
| 代理商： | W25Q32BVDAAP |
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W25Q32BV
Publication Release Date: April 01, 2011
- 79 -
Revision F
11. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
03/26/09
New Create Preliminary
B
08/20/09
5~8, 45, 46,
65~71
53
Removed SOIC-8 150-mil in Ordering Section.
Removed PDIP-8 300-mil Package
Added WSON-8 8x6-mm Package
Updated package diagram
Updated Suspend/Resume description
Updated UID waveform
C
09/24/09
5,7,9,67,72,73
51
55
Added PDIP-8 300-mil Package
Corrected Read Manufacturer / Device ID diagram
Corrected Read JEDEC ID diagram
D
11/05/09
74
63 & 64
Removed Preliminary designator
Updated AC/DC parameters
E
07/08/10
64
66-67
69-74
5, 10, 21, 56-58
5, 75 & 76
Updated VIL/VIH
Updated AC/DC parameters
Updated Package Diagrams
Added SFDP feature
Added automotive temperature
F
04/01/11
9, 76-78, 23-69,
47
57-59
Added TFBGA package
Updated diagrams
Added /WP timing diagram
Updated Suspend description
Updated SFDP to JEDEC 1.0
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,
death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q32BVDAIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVDAIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFAG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFAP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFIG | 功能描述:IC SPI FLASH 32MBIT 16SOIC RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
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