參數(shù)資料
型號(hào): W25Q32BVDAAP
廠商: WINBOND ELECTRONICS CORP
元件分類(lèi): PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDIP8
封裝: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件頁(yè)數(shù): 20/79頁(yè)
文件大?。?/td> 1090K
代理商: W25Q32BVDAAP
W25Q32BV
Publication Release Date: April 01, 2011
- 27 -
Revision F
DO
(IO
1)
7.2.10 Read Data (03h)
The Read Data instruction allows one or more data bytes to be sequentially read from the memory. The
instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed by a
24-bit address (A23-A0) into the DI pin. The code and address bits are latched on the rising edge of the
CLK pin. After the address is received, the data byte of the addressed memory location will be shifted out
on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The address is automatically
incremented to the next higher address after each byte of data is shifted out allowing for a continuous
stream of data. This means that the entire memory can be accessed with a single instruction as long as
the clock continues. The instruction is completed by driving /CS high.
The Read Data instruction sequence is shown in Figure 9. If a Read Data instruction is issued while an
Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any
effects on the current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of fR
(see AC Electrical Characteristics).
/CS
CLK
DI
(IO
0)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (03h)
High Impedance
8
9
10
28
29
30
31
32
33
34
35
36
37
38
39
7
6
5
4
3
2
1
0
7
24-Bit Address
23
22
21
3
2
1
0
Data Out 1
*
= MSB
*
Figure 9. Read Data Instruction Sequence Diagram
相關(guān)PDF資料
PDF描述
W25Q32BVDAIG 32M X 1 SPI BUS SERIAL EEPROM, PDIP8
W25Q32BVSFIG 32M X 1 SPI BUS SERIAL EEPROM, PDSO16
W3EG6466S335BD4S 64M X 64 DDR DRAM MODULE, 0.7 ns, DMA200
WEDF1M32B-70G2UC5A 1M X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68
WE128K32P-140G2TI 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q32BVDAIG 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVDAIP 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFAG 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFAP 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFIG 功能描述:IC SPI FLASH 32MBIT 16SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)