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參數(shù)資料
| 型號： | W25Q32BVDAAP |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 32M X 1 SPI BUS SERIAL EEPROM, PDIP8 |
| 封裝： | 0.300 INCH, GREEN, PLASTIC, DIP-8 |
| 文件頁數(shù)： | 22/79頁 |
| 文件大?。?/td> | 1090K |
| 代理商： | W25Q32BVDAAP |
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W25Q32BV
Publication Release Date: April 01, 2011
- 29 -
Revision F
7.2.12 Fast Read Dual Output (3Bh)
The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction except
that data is output on two pins; IO0 and IO1. This allows data to be transferred from the W25Q32BV at
twice the rate of standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly
downloading code from Flash to RAM upon power-up or for applications that cache code-segments to
RAM for execution.
Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest
possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight
“dummy” clocks after the 24-bit address as shown in Figure 11. The dummy clocks allow the device's
internal circuits additional time for setting up the initial address. The input data during the dummy clocks is
“don’t care”. However, the IO0 pin should be high-impedance prior to the falling edge of the first data out
clock.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (3Bh)
High Impedance
8
9
10
28
29
30
32
33
34
35
36
37
38
39
6
4
2
0
24-Bit Address
23
22
21
3
2
1
0
*
31
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Dummy Clocks
0
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
7
5
3
1
6
4
2
0
6
4
2
0
6
4
2
0
High Impedance
7
5
3
1
7
5
3
1
7
5
3
1
IO
0 switches from
Input to Output
6
7
Data Out 1
* Data Out 2
* Data Out 3
* Data Out 4
= MSB
*
Figure 11. Fast Read Dual Output Instruction Sequence Diagram
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PDF描述 |
|---|---|
| W25Q32BVDAIG | 32M X 1 SPI BUS SERIAL EEPROM, PDIP8 |
| W25Q32BVSFIG | 32M X 1 SPI BUS SERIAL EEPROM, PDSO16 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q32BVDAIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVDAIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFAG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFAP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFIG | 功能描述:IC SPI FLASH 32MBIT 16SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
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