參數(shù)資料
型號： UPD72850A
廠商： NEC Corp.
英文描述： IEEE1394 400Mbps PHY
中文描述： IEEE1394連接400Mbps的物理層
文件頁數(shù)： 6/48頁
文件大?。?/td> 290K
代理商： UPD72850A
Data Sheet S14452EJ1V0DS00
6
μ
PD72850A
4.6 Transmit..........................................................................................................................................30
4.7 Cancel .............................................................................................................................................31
4.8 Receive............................................................................................................................................32
5. CABLE PHY PACKET............................................................................................................................33
5.1 Self_ID Packet ................................................................................................................................33
5.2 Link-on Packet ...............................................................................................................................34
5.3 PHY Configuration Packet ............................................................................................................34
5.4 Extended PHY Packet....................................................................................................................34
5.4.1 Ping Packet...........................................................................................................................................35
5.4.2 Remote Access Packet.........................................................................................................................35
5.4.3 Remote Reply Packet...........................................................................................................................36
5.4.4 Remote Command Packet....................................................................................................................36
5.4.5 Remote Confirmation Packet................................................................................................................37
5.4.6 Resume Packet.....................................................................................................................................37
6. ELECTRICAL SPECIFICATIONS..........................................................................................................38
7. APPLICATION CIRCUIT EXAMPLE......................................................................................................43
7.1 IEEE1394 Interface.........................................................................................................................43
7.2 NEC/FFM Board Sharing...............................................................................................................44
8. PACKAGE DRAWING............................................................................................................................45
9. RECOMMENDED SOLDERING CONDITIONS...................................................................................46
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