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參數(shù)資料
| 型號(hào)： | UPD72042B |
| 廠商： | NEC Corp. |
| 英文描述： | LSI DEVICES FOR Inter Equipment BusTM (IEBusTM) PROTOCOL CONTROL |
| 中文描述： | LSI器件間設(shè)備BusTM（IEBusTM）協(xié)議控制 |
| 文件頁(yè)數(shù)： | 89/92頁(yè) |
| 文件大?。?/td> | 541K |
| 代理商： | UPD72042B |
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μ
PD72042A, 72042B
89
DATA SHEET S13990EJ2V0DS00
9. RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our
sales offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Surface mount devices
μ
PD72042AGT: 16-pin plastic SOP (375 mil)
μ
PD72042BGT: 16-pin plastic SOP (375 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 2 times.
IR35-00-2
VPS
Peak temperature: 215
°
C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 2 times.
VP15-00-2
Wave soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (Per each side of the device).
—
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
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