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| 型號： | TRK-MPC5604P |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 48/104頁 |
| 文件大小： | 0K |
| 描述： | 5604P TTK BD |
| 設(shè)計資源： | TRK-MPC5604P Component List TRK-MPC5604P Schematic |
| 標準包裝： | 1 |
| 系列： | MPC56xx |
| 類型： | MCU |
| 適用于相關(guān)產(chǎn)品： | MPC5604P |
| 所含物品： | 板，線纜，CD，DVD |
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MPC5604P Microcontroller Data Sheet, Rev. 8
Freescale
48
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
U.S.A.
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at
800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
1. C.E. Triplett and B. Joiner, An Experimental Characterization of a 272 PBGA Within an Automotive Engine Controller
Module, Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.
2. G. Kromann, S. Shidore, and S. Addison, Thermal Modeling of a PBGA for Air-Cooled Applications, Electronic
Packaging and Production, pp. 53–58, March 1998.
3. B. Joiner and V. Adams, Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in
Thermal Modeling, Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.
3.6
Electromagnetic interference (EMI) characteristics
3.7
Electrostatic discharge (ESD) characteristics
Table 12. EMI testing specifications
Symbol
Parameter
Conditions
Clocks
Frequency
Level
(Max)
Unit
VEME Radiated emissions Device configuration, test
conditions and EM testing per
standard IEC61967-2
Supply voltage = 5 V DC
Ambient temperature = 25 °C
Worst-case orientation
fOSC 8MHz
fCPU 64 MHz
No PLL frequency
modulation
150 kHz–150 MHz
16
dBV
150–1000 MHz
15
IEC Level
M
—
fOSC 8MHz
fCPU 64 MHz
1% PLL frequency
modulation
150 kHz–150 MHz
15
dBV
150–1000 MHz
14
IEC Level
M
—
Table 13. ESD ratings1,2
1 All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated
Circuits.
2 A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification requirements. Complete DC parametric and functional testing shall be performed per applicable
device specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Symbol
Parameter
Conditions
Value
Unit
VESD(HBM)
SR Electrostatic discharge (Human Body Model)
—
2000
V
VESD(CDM)
SR Electrostatic discharge (Charged Device Model)
—
750 (corners)
V
500 (other)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TRK-MPC5606B | 制造商:Freescale Semiconductor 功能描述:MPC5606B 144PIN REV 2.1 - Boxed Product (Development Kits) 制造商:Freescale Semiconductor 功能描述:STARTERTRAK DEV BOARD MPC5606B 制造商:Freescale Semiconductor 功能描述:MPC560 QORIVVA STARTER TRAK 制造商:Freescale Semiconductor 功能描述:PRIMARY PLATFORM ((NW)) 制造商:Freescale Semiconductor 功能描述:MPC560, QORIVVA, STARTER TRAK, DEV KIT 制造商:Freescale Semiconductor 功能描述:MPC5606B 144pin 制造商:Freescale Semiconductor 功能描述:EVAL KIT, MPC560B STARTERTRAK AUTO BODY ELECT; Silicon Manufacturer:Freescale; Core Architecture:Power Architecture; Core Sub-Architecture:Power Architecture; Silicon Core Number:MPC5xxx; Silicon Family Name:Qorivva |
| TRK-MPC5606B | 制造商:Freescale Semiconductor 功能描述:PRIMARY PLATFORM ((NW)) |
| TRK-MPC5634M | 功能描述:開發(fā)板和工具包 - 其他處理器 TRAK 5634M 144pn R2.1 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| TRK-USB-MPC5602P | 功能描述:開發(fā)板和工具包 - 其他處理器 STRAKMiniUSB RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| TRK-USB-MPC5604B | 功能描述:開發(fā)板和工具包 - 其他處理器 MiniUSB MPC5604B RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
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