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| 型號： | TRK-MPC5604P |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 47/104頁 |
| 文件大?。?/td> | 0K |
| 描述： | 5604P TTK BD |
| 設(shè)計資源： | TRK-MPC5604P Component List TRK-MPC5604P Schematic |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | MPC56xx |
| 類型： | MCU |
| 適用于相關(guān)產(chǎn)品： | MPC5604P |
| 所含物品： | 板，線纜，CD，DVD |
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MPC5604P Microcontroller Data Sheet, Rev. 8
Freescale
47
3.5.2
General notes for specifications at maximum junction temperature
TJ = TA + (RJA * PD)
Eqn. 1
where:
TA
= ambient temperature for the package (°C)
RJA
= junction to ambient thermal resistance (°C/W)
PD
= power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed in Equation 2 as the sum of a junction to case thermal resistance
and a case to ambient thermal resistance:
RJA = RJC + RCA
Eqn. 2
where:
RJA
= junction to ambient thermal resistance (°C/W)
RJC
= junction to case thermal resistance (°C/W)
RCA
= case to ambient thermal resistance (°C/W)
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to
ambient thermal resistance, RCA. For instance, the user can change the size of the heat sink, the air flow around the device, the
interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit
board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal
Characterization Parameter (
JT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using Equation 3:
TJ = TT + (JT x PD)
Eqn. 3
where:
TT
= thermocouple temperature on top of the package (°C)
JT
= thermal characterization parameter (°C/W)
PD
= power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
References:
5 Thermal characterization parameter indicating the temperature difference between the case and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JC.
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相關(guān)代理商/技術(shù)參數(shù) |
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| TRK-MPC5606B | 制造商:Freescale Semiconductor 功能描述:MPC5606B 144PIN REV 2.1 - Boxed Product (Development Kits) 制造商:Freescale Semiconductor 功能描述:STARTERTRAK DEV BOARD MPC5606B 制造商:Freescale Semiconductor 功能描述:MPC560 QORIVVA STARTER TRAK 制造商:Freescale Semiconductor 功能描述:PRIMARY PLATFORM ((NW)) 制造商:Freescale Semiconductor 功能描述:MPC560, QORIVVA, STARTER TRAK, DEV KIT 制造商:Freescale Semiconductor 功能描述:MPC5606B 144pin 制造商:Freescale Semiconductor 功能描述:EVAL KIT, MPC560B STARTERTRAK AUTO BODY ELECT; Silicon Manufacturer:Freescale; Core Architecture:Power Architecture; Core Sub-Architecture:Power Architecture; Silicon Core Number:MPC5xxx; Silicon Family Name:Qorivva |
| TRK-MPC5606B | 制造商:Freescale Semiconductor 功能描述:PRIMARY PLATFORM ((NW)) |
| TRK-MPC5634M | 功能描述:開發(fā)板和工具包 - 其他處理器 TRAK 5634M 144pn R2.1 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| TRK-USB-MPC5602P | 功能描述:開發(fā)板和工具包 - 其他處理器 STRAKMiniUSB RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| TRK-USB-MPC5604B | 功能描述:開發(fā)板和工具包 - 其他處理器 MiniUSB MPC5604B RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
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