參數(shù)資料
型號(hào)： TRK-MPC5604P
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 46/104頁(yè)
文件大?。?/td> 0K
描述： 5604P TTK BD
設(shè)計(jì)資源： TRK-MPC5604P Component List
TRK-MPC5604P Schematic
標(biāo)準(zhǔn)包裝： 1
系列： MPC56xx
類型： MCU
適用于相關(guān)產(chǎn)品： MPC5604P
所含物品： 板，線纜，CD，DVD
MPC5604P Microcontroller Data Sheet, Rev. 8
Freescale
46
3.5
Thermal characteristics
3.5.1
Package thermal characteristics
Table 10. Thermal characteristics for 144-pin LQFP
Symbol
Parameter
Conditions
Typical value Unit
RJA
Thermal resistance junction-to-ambient,
natural convection1
1 Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board
meets JEDEC specification for this package.
Single layer board—1s
54.2
°C/W
Four layer board—2s2p
44.4
°C/W
RJB
Thermal resistance junction-to-board2
2 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Four layer board—2s2p
29.9
°C/W
RJCtop Thermal resistance junction-to-case (top)3
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold
plate temperature is used for the case temperature. Reported value includes the thermal resistance
of the interface layer.
Single layer board—1s
9.3
°C/W
JB
Junction-to-board, natural convection4
4 Thermal characterization parameter indicating the temperature difference between the board and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JB.
Operating conditions
30.2
°C/W
JC
Junction-to-case, natural convection5
5 Thermal characterization parameter indicating the temperature difference between the case and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JC.
Operating conditions
0.8
°C/W
Table 11. Thermal characteristics for 100-pin LQFP
Symbol
Parameter
Conditions
Typical value Unit
RJA
Thermal resistance junction-to-ambient,
natural convection1
1 Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board
meets JEDEC specification for this package.
Single layer board—1s
47.3
°C/W
Four layer board—2s2p
35.3
°C/W
RJB
Thermal resistance junction-to-board2
2 Junction-to-board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets
JEDEC specification for the specified package.
Four layer board—2s2p
19.1
°C/W
RJCtop Thermal resistance junction-to-case (top)3
3 Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold
plate temperature is used for the case temperature. Reported value includes the thermal resistance
of the interface layer.
Single layer board—1s
9.7
°C/W
JB
Junction-to-board, natural convection4
4 Thermal characterization parameter indicating the temperature difference between the board and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JB.
Operating conditions
19.1
°C/W
JC
Junction-to-case, natural convection5
Operating conditions
0.8
°C/W
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