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參數(shù)資料
| 型號： | TMX320C6201 |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | Digital Signal Processors(1600MIPS at 200MHz，8個功能單元并行操作的DSP) |
| 中文描述： | 數(shù)字信號處理器（1600MIPS在200MHz，8個功能單元并行操作的數(shù)字信號處理器） |
| 文件頁數(shù)： | 38/72頁 |
| 文件大?。?/td> | 1552K |
| 代理商： | TMX320C6201 |
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TMX320C6201
DIGITAL SIGNAL PROCESSOR
SPRS051B – JANUARY 1997 – REVISED JUNE 1997
38
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
heat sink selection process – example 1
Specify operating conditions (this system reflects a typical PC operating environment using a production
version of the ’320C6201 with high performance internal memory arrays):
Pa
T
AMAX
V
AMIN
h
MAX
R
Θ
cs
T
CMAX
= 4.2 W
= 40
°
C
= 85 LFM
= 9 mm
= 0.5
°
C/W
= 90
°
C
Average power dissipated by the case
Ambient-air temperature
Air-approach velocity (linear feet per minute)
Height limit for the heat sink (system requirement)
Case-to-sink thermal resistance (using thermal epoxy)
Case temperature
Estimate the total power that needs to be dissipated by the heat sink, Ps:
Ps
T
AMAX
= Pa –1 W
= 4.2 – 1 = 3.2 W
Assume 1W dissipation through the board
Compute the maximum heat sink to air thermal resistance R
Θ
sa that maintains the case temperature below
T
CMAX
for the operating conditions specified previously:
R
Θ
sa
R
Θ
sa
R
Θ
sa
R
Θ
sa
+ R
Θ
cs = (T
C
– T
A
) / Ps
= {T
C
– T
A
) / Ps} – R
Θ
cs
= {(90 – 40) / 3.2} – 0.5
= 15.1
°
C/W
Choose the heat sink based on the computed maximum sink-to-air resistance R
Θ
sa and the minimum
air-approach velocity inside the enclosure. The heat-sink performance plot in Figure 20 verifies that at
85 LFM air velocity, the sink-to-air thermal resistance indeed stays at, or below, the Rsa value of 15.1 C/W
that is required to maintain the case temperature below T
CMAX
for the listed operating conditions. Actual
measurement of the case temperature must be performed next to verify heat sink performance.
P
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