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參數(shù)資料
| 型號(hào)： | TMP91FY12AF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 9/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91FY12AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-9
2002-02-20
Table 2.2 Usable period after opening moisture proof bags
SYMBOL
A = 168h
Usable period after opening moisture proof bags
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 168 hours (1 week),
after opened. If the products are kept beyond 168 hours (1 week) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 192 hours.
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 72 hours (3 days),
after opened. If the products are kept beyond 72 hours (3days) after opened, the
products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 96 hours (4 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 48 hours (2 days),
after opened. If the products are kept beyond 48 hours (2 days) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 72 hours (3 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 24 hours (1 day),
after opened. If the products are kept beyond 24 hours (1 day) after opened, the
products should be baked for at least 20 hours at 125°C before mounted. After baked,
the products should be stored in temperature below 30°C and relative humidity below
60%, and should be used within 48 hours (2 days).
Products sealed in moisture proof packing should be stored in temperature below
30°C and relative humidity below 60%, and should be used within 12 hours, after
opened. If the products are kept beyond 12 hours after opened, the products should
be baked for at least 20 hours at 125°C before mounted. After baked, the products
should be stored in temperature below 30°C and relative humidity below 60%, and
should be used within 36 hours.
For the details, contact your Toshiba local offices.
Overall heating method is not recommended for mounting ; use soldering iron method
of localized heating method.
B = 72h
C = 48h
D = 24h
E = 12h
G
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP91FY22F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP91FY22FG | 功能描述:IC MCU FLASH 16BIT 256K 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:TLCS-900/L1 標(biāo)準(zhǔn)包裝:330 系列:- 核心處理器:- 芯體尺寸:8/16-位 速度:40MHz 連通性:UART/USART 外圍設(shè)備:DMA，PWM，WDT 輸入/輸出數(shù):32 程序存儲(chǔ)器容量:- 程序存儲(chǔ)器類型:外部程序存儲(chǔ)器 EEPROM 大小:- RAM 容量:- 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:100-BQFP 包裝:管件 |
| TMP91FY28 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller |
| TMP91FY42FG | 制造商:Toshiba America Electronic Components 功能描述:IC 16BIT MCU 256K FLASH 120K RAM |
| TMP91FY42FG(C,JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT 256KB FLASH 100-LQFP |
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