參數(shù)資料
型號(hào)： TMP91FY12AF
廠商： Toshiba Corporation
元件分類： 微控制器
英文描述： Quality And Reliability Assurance / Handling Precautions
中文描述： 質(zhì)量與可靠性保證/操作注意事項(xiàng)
文件頁(yè)數(shù)： 41/48頁(yè)
文件大?。?/td> 390K
代理商： TMP91FY12AF
Quality and Reliability Assurance / Handling Precautions
030901
QUA-41
2002-02-20
(3)
Make sure that no surge voltages from the measuring equipment are
applied to the device.
The chips housed in tape carrier packages (TCPs) are bare chips and are
therefore exposed. During inspection take care not to crack the chip or
cause any flaws in it.
Electrical contact may also cause a chip to become faulty. Therefore make
sure that nothing comes into electrical contact with the chip.
(4)
4.5
Mounting
There are essentially two main types of semiconductor device package: lead
insertion and surface mount. During mounting on printed circuit boards, devices
can become contaminated by flux or damaged by thermal stress from the soldering
process. With surface-mount devices in particular, the most significant problem is
thermal stress from solder reflow, when the entire package is subjected to heat.
This section describes a recommended temperature profile for each mounting
method, as well as general precautions which you should take when mounting
devices on printed circuit boards. Note, however, that even for devices with the
same package type, the appropriate mounting method varies according to the size of
the chip and the size and shape of the lead frame. Therefore, please consult the
relevant technical datasheet or databook.
4.5.1 Lead Forming
x
Always wear protective glasses when cutting the leads of a device
with clippers or a similar tool. If you do not, small bits of metal
flying off the cut ends may damage your eyes.
y
Do not touch the tips of device leads. Because some types of device
have leads with pointed tips, you may prick your finger.
Semiconductor devices must undergo a process in which the leads are cut and
formed before the devices can be mounted on a printed circuit board. If undue
stress is applied to the interior of a device during this process, mechanical
breakdown or performance degradation can result. This is attributable
primarily to differences between the stress on the device’s external leads and
the stress on the internal leads. If the relative difference is great enough, the
device’s internal leads, adhesive properties or sealant can be damaged.
Observe these precautions during the lead-forming process (this does not
apply to surface-mount devices):
(1)
Lead insertion hole intervals on the printed circuit board should match
the lead pitch of the device precisely.
If lead insertion hole intervals on the printed circuit board do not
precisely match the lead pitch of the device, do not attempt to forcibly
insert devices by pressing on them or by pulling on their leads.
(2)
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