參數(shù)資料
型號(hào): TMP91FY12AF
廠商: Toshiba Corporation
元件分類: 微控制器
英文描述: Quality And Reliability Assurance / Handling Precautions
中文描述: 質(zhì)量與可靠性保證/操作注意事項(xiàng)
文件頁(yè)數(shù): 43/48頁(yè)
文件大小: 390K
代理商: TMP91FY12AF
Quality and Reliability Assurance / Handling Precautions
030901
QUA-43
2002-02-20
4.5.3 Soldering Temperature Profile
The soldering temperature and heating time vary from device to device.
Therefore, when specifying the mounting conditions, refer to the individual
datasheets and databooks for the devices used.
(1)
Using a Soldering Iron
Complete soldering within ten seconds for lead temperatures of up to
260°C, or within three seconds for lead temperatures up to 350°C.
(2)
Standard Mounting Conditions for SMDs
(Surface Mount Devices)
For details, refer to section 2.1 Mounting Precautions in chapter 2
Handling Precautions for Microcontrollers.
相關(guān)PDF資料
PDF描述
TMP91FY22F Quality And Reliability Assurance / Handling Precautions
TMP91PW10F Quality And Reliability Assurance / Handling Precautions
TMP91PW11F Quality And Reliability Assurance / Handling Precautions
TMP91PW12F Quality And Reliability Assurance / Handling Precautions
TMP91PW18AF Quality And Reliability Assurance / Handling Precautions
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TMP91FY22F 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions
TMP91FY22FG 功能描述:IC MCU FLASH 16BIT 256K 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:TLCS-900/L1 標(biāo)準(zhǔn)包裝:330 系列:- 核心處理器:- 芯體尺寸:8/16-位 速度:40MHz 連通性:UART/USART 外圍設(shè)備:DMA,PWM,WDT 輸入/輸出數(shù):32 程序存儲(chǔ)器容量:- 程序存儲(chǔ)器類型:外部程序存儲(chǔ)器 EEPROM 大小:- RAM 容量:- 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:100-BQFP 包裝:管件
TMP91FY28 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller
TMP91FY42FG 制造商:Toshiba America Electronic Components 功能描述:IC 16BIT MCU 256K FLASH 120K RAM
TMP91FY42FG(C,JZ) 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT 256KB FLASH 100-LQFP