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參數(shù)資料
| 型號(hào)： | TMP91FY12AF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 45/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91FY12AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-45
2002-02-20
4.5.5 Circuit Board Coating
When devices are to be used in equipment requiring a high degree of reliability
or in extreme environments (where moisture, corrosive gas or dust is present),
circuit boards may be coated for protection. However, before doing so, you
must carefully consider the possible stress and contamination effects that may
result and then choose the coating resin which results in the minimum level of
stress to the device.
4.6
Protecting Devices in the Field
4.6.1 Temperature
Semiconductor devices are generally more sensitive to temperature than are
other electronic components. The various electrical characteristics of a
semiconductor device are dependent on the ambient temperature at which the
device is used. It is therefore necessary to understand the temperature
characteristics of a device and to incorporate device derating into circuit
design. Note also that if a device is used above its maximum temperature
rating, device deterioration is more rapid and it will reach the end of its usable
life sooner than expected.
4.6.2 Humidity
Resin-molded devices are sometimes improperly sealed. When these devices
are used for an extended period of time in a high-humidity environment,
moisture can penetrate into the device and cause chip degradation or
malfunction. Furthermore, when devices are mounted on a regular printed
circuit board, the impedance between wiring components can decrease under
high-humidity conditions. In systems which require a high signal-source
impedance, circuit board leakage or leakage between device lead pins can
cause malfunctions. The application of a moisture-proof treatment to the
device surface should be considered in this case. On the other hand, operation
under low-humidity conditions can damage a device due to the occurrence of
electrostatic discharge. Unless damp-proofing measures have been specifically
taken, use devices only in environments with appropriate ambient moisture
levels (i.e. within a relative humidity range of 40% to 60%).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TMP91FY22F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP91FY22FG | 功能描述:IC MCU FLASH 16BIT 256K 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:TLCS-900/L1 標(biāo)準(zhǔn)包裝:330 系列:- 核心處理器:- 芯體尺寸:8/16-位 速度:40MHz 連通性:UART/USART 外圍設(shè)備:DMA，PWM，WDT 輸入/輸出數(shù):32 程序存儲(chǔ)器容量:- 程序存儲(chǔ)器類型:外部程序存儲(chǔ)器 EEPROM 大小:- RAM 容量:- 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:100-BQFP 包裝:管件 |
| TMP91FY28 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller |
| TMP91FY42FG | 制造商:Toshiba America Electronic Components 功能描述:IC 16BIT MCU 256K FLASH 120K RAM |
| TMP91FY42FG(C,JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT 256KB FLASH 100-LQFP |
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