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參數(shù)資料
| 型號： | TMP91FY12AF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項 |
| 文件頁數(shù)： | 12/48頁 |
| 文件大?。?/td> | 390K |
| 代理商： | TMP91FY12AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-12
2002-02-20
(2) 90 Series
Table 2.4 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/2)
Products
Name
Package no.
Air reflow
Infrared reflow
TMP90C840AF
TMP90C841AF
TMP91C640F
TMP91C641F
TMP90CM40AF
TMP90C041AF
TMP90C141F
TMP90C441F
TMP90C802AM
TMP90C803AM
TMP90CH02M
TMP90CH03M
TMP90C400F
TMP90C401F
TMP90C800F
TMP90C801F
TMP90C844AF
TMP90CH44F
TMP90C845AF
TMP90CH45F
TMP90CM36F
TMP90CM37F
TMP90CM38F
TMP90CM39F
TMP90C051F
TMP90CS36F
TMP90CS37F
TMP90CS38F
TMP90CS39F
TMP90C848F
TMP91P640F
TMP90PM40F
TMP90P802AM
TMP90PH02M
TMP90P800F
TMP90PH44F
TMP90PM36F
TMP90PM38F
TMP90PS36F
TMP90PS38F
Note 1:
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1420-0.80B
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP80-1420-0.80B
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-SSOP40-450-0.80
P-SSOP40-450-0.80
P-QFP64-1420-1.00A
P-QFP64-1420-1.00A
P-QFP80-1414-0.65A
P-QFP80-1414-0.65A
P-QFP44-1414-0.65A
P-QFP44-1414-0.65A
As of September, 2001
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 2:
Ensure that the conditions for top/bottom heating using the
long/medium infrared reflow method are strictly adhered to, even when
this method is used in combination with the air reflow method.
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G
and
indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
Note 3:
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| TMP91FY42FG(C,JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT 256KB FLASH 100-LQFP |
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